Study for degradation of 1-step adhesive systems affected by residual solvents

残留溶剂影响的一步胶系统降解研究

• 批准号: 20592218
• 负责人: IKEDA Takatsumi
• 金额: $ 2.83万
• 依托单位: Hokkaido University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2008
• 资助国家: 日本
• 起止时间: 2008 至 2012
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-20592218/
• 关键词: 接着システム; 溶媒; 劣化; 耐久性; 1ステップ型; 接着耐久性; 接着性修復; 1ステップ型接着システム; 保存修復学

This study evaluated relationship between bonding performance of 1-step adhesive systems and residual solvent contained in the systems. Bond strengths of the systems were decreased in the both cases of so much residual solvent existed and too much solvent was removed. Optimal amount of the solvents differed in each systems.In addition, bonding durability of the 1-step adhesive systems was also evaluated after20,000 times of thermal cycling or 12 months of water storage. As the results of that, there was no statistical difference after thermal cycling. However, significant decrease in tensile bond strengths were observed after 12 months of water storage, and the decrease was differ in each adhesive systems.

本研究评估了一步粘合剂系统的粘合性能与系统中所含残留溶剂之间的关系。在存在过多残留溶剂和去除过多溶剂的两种情况下，体系的粘合强度均降低。每个系统中溶剂的最佳用量不同。此外，还在20,000次热循环或12个月的水储存后评估了1步粘合剂系统的粘合耐久性。结果，热循环后没有统计学差异。然而，在水储存12个月后，观察到拉伸粘合强度显着下降，并且每个粘合剂体系的下降程度不同。

项目成果

Long term bonding performance of contemporary and experimental self-etching adhesives

现代和实验自蚀刻粘合剂的长期​​粘合性能

• 发表时间: 2011
• 作者: Jiale FU,Feng PAN,Shinichi KAKUDA,Sharanbir K SIDHU,Takatsumi IKEDA,Yasuko NAKAOKI;Denis SELIMOVIC and Hidehiko SANO;Fu Jiale;Fu Jiale;付佳楽;Kakuda S
• 通讯作者: Kakuda S

Bond durability of four contemporary self-etching systems

四种当代自蚀刻系统的粘合耐久性

• 发表时间: 2012
• 作者: Fu J;Okuyama K;Nakaoki Y.
• 通讯作者: Nakaoki Y.

Bonding Performance of Contemporary Self-etching Adhesives

现代自蚀刻粘合剂的粘合性能

• 发表时间: 2010
• 作者: J. FU(発表者);K. YASUMOTO;S. HOSHIKA;T. IKEDA;H. SANO.
• 通讯作者: H. SANO.

Bonding Performance of Contemporary Self-etching Adhesives.

现代自蚀刻粘合剂的粘合性能。

• 发表时间: 2010
• 作者: J. FU(発表者);K. YASUMOTO;S. HOSHIKA;T. IKEDA;H. SANO.;Fu Jiale
• 通讯作者: Fu Jiale