Electronic Structure of Homo-phase Grain Boundaries and Correlated Percolation -Fundamental Understanding of Transport Property and Nano-scale Microstructure Control of Composite Superconductors-

同相晶界的电子结构及相关渗流-复合超导体输运特性与纳米尺度微观结构控制的基本认识-

基本信息

批准号：
13305045
负责人：
OSAMURA Kozo
金额：
$ 3万
依托单位：
KYOTO UNIVERSITY
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (A)
财政年份：
2001
资助国家：
日本
起止时间：
2001 至 2002
项目状态：
已结题

项目摘要

1.Sample preparation and microstructure observation : in order to make clear the degree of texturing, the polycrystalline Bi2223 films were prepared on the textured Ag substrate, Mg0 or SrTi03 single crystal. The crystal orientation was investigated by means of EBSP and the microstructural features of grain boundaries have been precisely analyzed by using SEM and EPMA. The crystal growth technique to prepare the [0011 oriented Bi2223 film with 1 micron-meter was established.2.Measurement and analysis of critical currents : the current - voltage relationship has been investigated at the micro-area by using the patterned samples. Its angular dependence of magnetic field and the strain dependence in Y123 thin films were precisely measured. The temperature dependence of critical current was measured in Bi2223 films. Their experimental data were applied to Weibull analysis. The high performance Bi2223 thin film with critical current density higher than 1 MA/m2 at 77 K has been developed.3.A … More nalysis of critical current of Bi2223 tape by using Weak Link Path model : the optimum percolation path in the sample has been estimated based on the model. The J-E curve obtained by computer simulation was compared with the experimental data. From the comparison, some microstructure factors like (a) current concentration, (b) clustering of non-SC links, (c) distribution of non-SC clusters have been elucidated.4.Improvement of transport property in the polycrystalline samples based on the Weak Link Path model : the optimization of transport properties was considered from the theoretical calculation based on the model. As a result, the microstructure model to realized the optimum property in Bi2223 tapes was proposed, where the grain boundary weak link limits the critical current.5.Mechanical property and its influence to critical current in Bi2223 tapes : the mechanical property of Bi2223 tapes was analyzed based on the rule of mixture by taking into consideration about the thermal residual stress. The true stress exerted on the SC oxide layer was made clear. In the stress region up to 60 MPa, the critical current reversibly decreased with increasing stress. This phenomenon was attributed to the SNS junction of the weak link at homo-phase grain boundaries. Less

1.样品制备及显微组织观察：为了明确织构化程度，在织构化的Ag基体、Mg0或SrTi03单晶上制备了多晶Bi2223薄膜，并通过EBSP研究了晶体取向和显微结构特征。利用SEM和EPMA对晶界进行了精确分析，采用晶体生长技术制备了1微米的[0011取向Bi2223薄膜。 2.临界电流的测量和分析：通过使用图案化样品研究了微区域的电流-电压关系，并精确测量了Y123薄膜中的磁场角度依赖性和温度依赖性。测量了 Bi2223 薄膜中临界电流的依赖性，并将其实验数据应用于 Weibull 分析，得到了 77 K 下临界电流密度高于 1 MA/m2 的高性能 Bi2223 薄膜。 3.利用弱连接路径模型对Bi2223带的临界电流进行分析：根据该模型估计了样品中的最佳渗流路径，并将计算机模拟得到的J-E曲线与实验数据进行了比较。通过比较，阐明了一些微观结构因素，例如（a）电流集中，（b）非SC链接的聚类，（c）非SC簇的分布。4.改善了传输性能基于弱连接路径模型的多晶样品：基于该模型的理论计算考虑了传输性能的优化，因此提出了实现 Bi2223 带材最佳性能的微观结构模型，其中晶界弱连接。 5、Bi2223带材机械性能及其对临界电流的影响：基于混合法则，考虑热残余应力，分析了Bi2223带材的机械性能。明确了SC氧化层上施加的真实应力在高达60 MPa的应力区域中，随着应力的增加，临界电流可逆地减小，这种现象归因于同相晶界处的薄弱环节的SNS结。

项目成果

期刊论文数量（17）

专著数量（0）

科研奖励数量（0）

会议论文数量（0）

专利数量（0）

Numerical analysis of the inhomogeneous current transport properties of Ag/Bi2223 tapes

Ag/Bi2223 带材非均匀电流传输特性的数值分析

DOI：
发表时间：
2003
期刊：
Phys.Rew. 67
影响因子：
0
作者：
K.Osamura et al.;K.Osamura et al.
通讯作者：
K.Osamura et al.

The stage Behavior in Stress -Elongation Curve Multifilamentary Bi2223 Tapes

Bi2223复丝带的应力伸长曲线阶段行为

DOI：
发表时间：
2002
期刊：
Adv.Cryog.Eng. 48
影响因子：
0
作者：
K.Osamura et al.;K.Osamura et al.;K.Osamura et al.;K.Osamura et al.;Z.G.Li;K.Osamura et al.;K.Osamura et al.;S.Miyake;K.Osamura et al.;Z.G.Li;K.Osamura et al.;Z.G.Li;K.Osamura et al.
通讯作者：
K.Osamura et al.

K.Osamura et al.: "Three Stage Behavior in Stress-Elongation Curve of Multifilamentary Bi2223 Tapes"Adv. Cryog. Eng.. 48. 477-483 (2002)

K.Osamura 等人：“复丝 Bi2223 胶带应力伸长曲线的三阶段行为”Adv.

DOI：
发表时间：
期刊：
影响因子：
0
作者：
通讯作者：

T.Doi 他: "Biaxially Oriented Nd123 Films Prepaed on Textured Ag Tapes"IEEE Trans. Applied. Supercond. 11. 3130-3133 (2001)

T. Doi 等人：“在纹理银带上制备的双向 Nd123 薄膜”，IEEE Trans. 11. 3130-3133 (2001)。

DOI：
发表时间：
期刊：
影响因子：
0
作者：
通讯作者：

Biaxially Oriented NdBa_2Cu_3O_7 Films Prepared on {100}<001> Textured Ag Tapes without Any Buffer Layers

在没有任何缓冲层的 {100}<001> 纹理银带上制备的双向 NdBa_2Cu_3O_7 薄膜

DOI：
发表时间：
2001
期刊：
IEEE Trans.Applied.Supercond. 11
影响因子：
0
作者：
K.Osamura et al.;K.Osamura et al.;K.Osamura et al.;K.Osamura et al.;Z.G.Li;K.Osamura et al.;K.Osamura et al.;S.Miyake;K.Osamura et al.;Z.G.Li;K.Osamura et al.;Z.G.Li;K.Osamura et al.;Z.G.Li;K.Osamura et al.;T.Doi et al.
通讯作者：
T.Doi et al.