Control of Composition Ratio of Alloy Films by New Magnetron Sputtering and Application to a Joining of Metal-Seramics

新型磁控溅射合金薄膜成分比例控制及其在金属陶瓷连接中的应用

• 批准号: 01850067
• 负责人: NAKASHIMA Takayoshi
• 金额: $ 1.28万
• 依托单位: Toyama National College of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Developmental Scientific Research (B).
• 财政年份: 1989
• 资助国家: 日本
• 起止时间: 1989 至 1990
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-01850067/
• 关键词: Composition Ratio; Alloy Films; Magnetin Sputtering; Multi-Layer Structure; Ceramic-Ceramic Joining; Wetting; Brazing; 組成制御; スパッタ; ソレノイドコイル; 組成比; 接合強度; マグネットロンスパッタリング; 銅-チタン合金; シリコンカ-バイド; アルミナ; タ-ゲット; 接触角; 固相拡散接合; Composition Ratio; Alloy Films; Magnetin Sputtering; Multi-Layer Structure; Ceramic-Ceramic Joining; Wetting; Brazing; 組成制御; スパッタ; ソレノイドコイル; 組成比; 接合強度; マグネットロンスパッタリング; 銅-チタン合金; シリコンカ-バイド; アルミナ; タ-ゲット; 接触角; 固相拡散接合

We propose a new method to control a composition ratio of metal alloy film by new magnetron sputtering method. This magnetron sputtering source has two magnetic coils, one is a conventional magnetron coil behind the target (Bm) and the other is a compressing coil (Bc) to increase magnetic field parallel to the target surface. The Bm and Bc can control the special position of intense plasma on the target surface. Experiments were performed concentric circular target jointed together Cu plate (75 phi) and Ti plate (35 phi). A Cu/Ti composition ratio can be controlled by the magnetic field Bc for constant Bm.The Cu/Ti ratio was estimated using an x-ray energy dispersive spectrometer. Ti content increases with increasing Bc because the plasma is concentrated on the Ti target. The Cu/Ti ratio is controlled from 20% to 80% by changing Bc.We can also fabricate multi-layer structure Cu-Ti alloy films with different composition ratio by different DC magnetic fields Bc. The sputtered films showed the uniform quality around 40mm phi on the film surface.We carried out a ceramic_-ceramic and ceramic_-metal joining using the sputtered films. The contact angle of molten Cu-Ti alloys containing Ti content up to 60 at. % on SiC was investigated by a sessile drop technique at 1373K in vacuum, and the joining of SiC to SiC and Al_2O_3 to Al_2O_3 were conducted using sputtered films of Cu_-Ti, Ti and Zr.Ti and Zr depress the reaction of Cu with SiC by forming TiC, Ti_3SiC_2 carbides and ZrC respectively. The fracture shear testing of SiC and Al_2O_3 joints were carried out at room temperature. The joining strength of SiC and Al_2O_3 using sputtered films ofCu_-Ti, Ti and Zr are lower than that of ceramics using amorphous filler metals of Cu_-Ti.

我们提出了一种新方法，以通过新的Magnetron溅射方法来控制金属合金膜的组成比。该磁控溅射源具有两个磁管线圈，一个是目标后面的常规磁控线圈（BM），另一个是压缩线圈（BC），以增加与目标表面平行的磁场。 BM和BC可以控制目标表面上强烈等离子体的特殊位置。实验是将铜板（75 Phi）和Ti板（35 PHI）的同心圆形靶进行的。 Cu/Ti组成比可以由磁场BC控制常数B。使用X射线能量色散光谱仪估算Cu/Ti比。 Ti含量随着BC的增加而增加，因为血浆集中在Ti靶标上。通过更改BC将Cu/Ti比从20％到80％控制。我们还可以通过不同的DC磁场BC制造具有不同组成比的多层结构Cu-Ti合金膜。溅射的薄膜在膜表面上显示了均匀的质量约40毫米PHI。我们使用溅射膜进行了陶瓷_-Ceramic和ceramic_-metal连接。熔融Cu-Ti合金的接触角，其中含有高达60个Ti的含量。 SIC上的％通过1373K真空中的一项连续滴技术进行了研究，并使用Cu_-Ti，Ti和Zr.ti和Zr的溅射膜将SIC与SIC和Al_2O_3连接到Al_2O_3，并通过形成Cu的反应，通过形成SIC的反应，通过形成TIC，TIC，TI_3SIC和ZR，进行SIC的反应。 SIC和Al_2O_3关节的断裂剪切测试是在室温下进行的。使用溅射膜Ofcu_-ti，Ti和Zr的SIC和Al_2O_3的连接强度低于使用Cu_-Ti的无定形填充金属的陶瓷。