DEVELOPMENT OF POWDER JET PROCESSING METHOD AND A MECHANISM CHANGE IN PROCESSES OF MATERIAL REMOVAL AND POWDER DEPOSITION

粉末喷射加工方法的开发及材料去除和粉末沉积过程的机理改变

基本信息

批准号：
13450051
负责人：
KURIYAGAWA Tsunemoto
金额：
$ 9.6万
依托单位：
TOHOKU UNIVERSITY
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
2001
资助国家：
日本
起止时间：
2001 至 2002
项目状态：
已结题

项目摘要

Much attention has been paid to a development of micro-sensors and micro-actuators on the order of sub-millimeter size (around 0.01-1mm), which are necessary for micro electrical/mechanical system (MEMS) such as a micro-machine. In this study, we developed a powder jet process, which is one of applications of abrasive jet machining. In this process, micro-particles ( φ 0.1-several μm), which are accelerated by a carrier gas, impinge with a high velocity and accumulate onto a substrate under vacuum or atmospheric condition, and forms thick film. Though the deposition rate is large enough to manufacture a functional structure of sub-millimeter size, there are problems that the deposition rate and mixture ratio, which are related to form accuracy and a density of the structure, are unstable. This is because a mixing and blasting mechanism of carrier gas and micro-particle is inadequate. Last year, we have developed the powder jet device that can blast micro-particles quantitatively and in … More termittently under vacuum condition, and experimented with the device. However, because there are various limitations under vacuum condition, taking practical use into consideration, powder deposition under atmospheric condition is more useful than under vacuum condition. Thus, a possibility of a powder deposition under atmospheric condition was confirmed. Next, we investigated a transition diameter of a particle, at which the mechanism changes from a material removal to a deposition. Furthermore, influences of blasting conditions such as blasting velocity and pressure, and matrials of powers and workpiece material on adhesive strength of formed thick film were investigated. The results of the experiments show that the transition diameter of particle is about 2.0μm and a smaller particle shows an adhesion phenomena when blasting alumina or silicon carbide particles to glass or silicon substrate under atmospheric pressure. And deposition height became stationary after several seconds and reached 20-120μm in thickness. And it becomes clear that kinetic energy of blasted particles and hardness of a substrate workpiece have a large influence on adhesive characteristics. In addition, we suggest a new evaluation method of mechanical properties of the film from a difference of micro-hardness and dynamic hardness values. In this method, the hardness of the formed film on a silicon substrate is bigger than on a glass. Furthermore, it is confirmed that electronic industry materials, such as PZT or ferrite, can be deposited under atmospheric pressure. Less

对于微型电气/机械系统（MEMS）（例如微型机械），我们已经为微观传感器的开发和亚毫米尺寸（约0.01-1mm）的阶数所支付。，这是磨蚀性喷射的应用。问题是问题速率和混合率的问题以及结构的密度，这是载气和微颗粒的混合和爆炸机制不足。粒子在真空状态下进行了定量，并考虑了E的粉末。从材料去除到矿床，研究了爆炸的爆炸，例如爆炸的速度和压力，以及膜的粘合剂的势力和工件材料的材料。在大气压力下，碳纤维颗粒或硅底物在大气压力上静止不动. ES Of The Film from A Difference of Micro-Hardness and Dynamic Hardness Value. BIGGER THAN ON A Glass. FurtherMore, it Confirmed That Electronic Industry Materials, Such as Pzt or Ferrite, can be deposited under the under atmospheric presure. Less