Experimental study on the evaporative cooling of densely packed LSI chips by use of a natural circulation loop

自然循环回路蒸发冷却密集LSI芯片的实验研究

• 批准号: 12450089
• 负责人: HONDA Hiroshi
• 金额: $ 7.36万
• 依托单位: Kyushu University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 2000
• 资助国家: 日本
• 起止时间: 2000 至 2002
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-12450089/
• 关键词: LSI chip; Evaporative Coolong; Natural Circulation; High Flux Cooling; Dielctric Liquid; Micro-Pin-Fin; 自然循環方式; 不伝導性液体

Two experiments that were aimed at high flux liquid cooling of LSI chips were conducted concurrently. The first experiment was concerned with the performance of a natural circulation liquid cooling system consisting of a horizontal evaporator, a test chip, a vertical tube, a horizontal condenser, a downcomer, a liquid subcooler, and a rubber bag for maintaining atmospheric pressure. A smooth test chip and four test chips with micro-pin-fins (dimensions of 30×60, 30×200, 50×190, 50×270 μm^2) were tested. The test chip had the dimensions of 10×10×0.5 mm^3. It was located at the bottom surface of a horizontal duct with the cross section of 5×14 mm^2. FC-72 was used as a test liquid. The circulation rate of FC-72 W ranged from 120 to 270 g/min for the liquid column height of 300 mm and the power input to the evaporator of 100-250 W. Heat transfer experiments were conducted at W = 150 and 200 g/min and the liquid subcooling of 10, 25 and 35 K. The heat transfer characteristics was basically the same as the case of pool boil ing except that the critical heat flux q_<CHF> decreased considerably. Comparison of the results for W= 150 and 200 g/min revealed that while the heat transfer coefficient in the nucleate boiling region was somewhat higher for W - 150 g/min, the critical heat flux was lower by a maximum of 10 %. The highest value of q_<CHF> obtained was 56 W/cm^2. The second experiment was concerned with the effect of the size of micro-pin-fin on the pool boiling of FC-72. The fin dimensions ranged from 10 to 50 μm for the thickness, and from 60 to 270 μm for the height. The liquid subcooling was set at 0, 3, 25 and 45 K. For all micro-pin-finned chips, the slope of nucleate boiling curve was very steep and the wall superheat at the critical heat flux point was less than the maximum allowable temperature for LSI chips (= 85 ℃). The q_<CHF> increased with increasing fin height and liquid subcooling. The highest value of q_<CHF> obtained was 85 W/cm^2.

两个针对高通量液体芯片的经验是指第一个实验。液体亚冷却器和一个用于维持大气压力的橡胶袋位于14毫米^2的底部表面。 10，25 k。传热性炭子基本上与案例相同，只是那个临界热通量q_ <chf>降低了w = 150和min的比较。对于W -150 g/min的通量，最大的Q__ << CHF>的最高值为56 W/cm^2，对W -150 g/min的通量的核沸腾系数较高。微针鳍的尺寸对厚度的10至50μm的池膜的影响，高度从60到270。 45 K.对于所有微针保存的芯片E非常陡峭，临界热量点的壁超热比LSI芯片的最大值允许AMATER（= 85°C）。 Q_ <CHF>获得的最高值为85 W/cm^2。

项目成果

H.Honda, H.Takamatsu, J.J.Wei: "Enhanced Boiling of FC-72 on Silicon Chips with Micro-Pin-Fins and Submicron-Scale Roughness"Trans.ASME, J.Heat Transfer. Vol.124, No.2. (2002)

H.Honda、H.Takamatsu、J.J.Wei：“在具有微型针翅和亚微米级粗糙度的硅芯片上增强 FC-72 的沸腾”Trans.ASME、J.Heat Transfer。

H. Honda, H. Takamatsu, J.J. Wei: "Enhanced Boiling of FC-72 on Silicon Chips with Micro-Pin-Fins and Submicron-Scale Roughness"Trans. ASME, Journal of Heat Transfer. Vol.124, No.2. 383-390 (2002)

H.本田、H.高松、J.J.

H. Honda, H. Takamatsu, J.J. Wei: "Boiling of FC-72 on Silicon Chips with Micro-Pin-Fins and Submicron-Scale Roughness"Trans. JSME, Ser. B. Vol.68, No.666. 519-526 (2002)

H.本田、H.高松、J.J.

本田博司, 高松 洋, 魏 進家: "マイクロピンフィンを有するシリコンチップ上のFC-72の沸騰熱伝達に及ぼすフィン寸法の影響"日本機械学会論文集B編. 68巻672号. 2327-2332 (2002)

Hiroshi Honda、Hiroshi Takamatsu、Jinjia Wei：“翅片尺寸对带微针翅片的硅芯片上 FC-72 沸腾传热的影响”，日本机械工程师学会汇刊，第 B 卷，第 68 卷，第 672 期。 2327-2332（2002）

H.Honda, H.Takamatsu, J.J.Wei: "Effect of Surface Microstructure on Boiling Heat Transfer from Silicon Chips Immersed in FC-72"Thermal Science & Engineering. Vol.9,No.5. 9-17 (2002)

H.Honda、H.Takamatsu、J.J.Wei：“表面微观结构对浸泡在 FC-72 中的硅片沸腾传热的影响”热科学