RF MEMS device based on micromachining

基于微机械加工的射频MEMS器件

基本信息

批准号：
16201027
负责人：
ESASHI Masayoshi
金额：
$ 31.2万
依托单位：
Tohoku University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (A)
财政年份：
2004
资助国家：
日本
起止时间：
2004 至 2006
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-16201027/
关键词：
Micromachining Micromachine Wireless MEMS Sensor Actuator Relay Resonator マイクロマシニング

项目摘要

Three-dimensional microstructures, sensors and actuators can be fabricated on a silicon chip using micromachining which is an extended technology based microfabrication for integrated circuits. RF MEMS (Radio Frequency Micro Electro Mechanical Systems) has been developed to produce RF components for wireless systems. Switches (relays), variable capacitors, micromechanical resonators for time (frequency) references or RF filters, RF interconnection and coils which are fabricated on thin self supported membranes and hence have small stray capacitances can be made by this technology. Following achievements are obtained in this research program.Packaging technologies for the RF MEMS as wafer level packaging processes and electrical feedthrough structures for an electrical interconnection for high speed signal from the top side to the backside of silicon chips were developed. MEMS switches as contact type and capacitive type which are actuated electrostatically were developed.MEMS switches … More were applied for a flexible flat panel display and commercialized as components for high speed LSI testers.Micromechanical resonators can have high resonant frequencies. The extension mode enables higher resonant frequency than the bending mode because of the high spring constant of the extension mode. By making the resonant frequency determined by the lateral dimension multiple resonators with different resonant frequencies can be integrated on a chip. An electrostatically driven wine glass mode silicon disk resonator of witch diameter is 20 μm demonstrated a resonant frequencies of approximately 100 MHz. Since the resonant frequency of such small resonators can be fluctuated by absorbing gas MEMS resonator was fabricated in a vacuum cavity in a silicon chip to stabilize the resonant frequency. Micromechanical resonators have an inherent problem of phase noise caused by thermomechanical noise.The thermomechanical noise also limit the resolution of resonating sensors. Extreme sensitivity is required for MRFM (Magnetic Resonance Force Microscopy) for the MRI (Magnetic Resonance Microscopy) of small samples as biological cell. The noise problems were studied and the phase noise could be reduced by a parametric squeeze damping. Cantilever resonant sensors which have high quality factor in atmosphere were.developed by using quartz material with thickness share mode.High aspect ratio planer coils.were fabricated to reduce the resistance.and high quality factor as high as 85 at 1.6 GHz was achieved for the purpose of the MRI for the small samples. Less

三维微结构、传感器和执行器可以使用微机械加工在硅芯片上制造，微机械加工是一种基于集成电路微加工的扩展技术，已开发用于生产无线系统的射频组件。（继电器）、可变电容器、用于时间（频率）参考或射频滤波器的微机械谐振器、射频互连和在薄自支撑上制造的线圈通过该技术可以获得以下成果：RF MEMS 的封装技术，如晶圆级封装工艺和用于来自顶部的高速信号的电互连的电馈通结构。开发了硅芯片背面的接触式和静电驱动的电容式MEMS开关。MEMS开关…更多用于柔性平板显示器，并作为高速LSI的部件而商品化。由于延伸模式的弹簧常数较高，微机械谐振器可以具有比弯曲模式更高的谐振频率。通过使谐振频率由横向尺寸确定，可以形成具有不同谐振频率的多个谐振器。集成在芯片上的静电驱动酒杯模式硅盘谐振器的直径为 20 μm，谐振频率约为 100 MHz。这种小型谐振器可以通过吸收气体来波动。MEMS谐振器是在硅芯片的真空腔中制造的，以稳定谐振频率。微机械谐振器存在由热机械噪声引起的相位噪声的固有问题。热机械噪声也限制了分辨率。 MRFM（磁共振力显微镜）需要极高的灵敏度，用于生物小样品的 MRI（磁共振显微镜）。研究了噪声问题，并采用厚度共享模式的石英材料开发了参数挤压阻尼来降低相位噪声的悬臂梁谐振传感器。降低了电阻，并在 1.6 GHz 下实现了高达 85 的高品质因数，适用于小样本的 MRI。