RF MEMS device based on micromachining

基于微机械加工的射频MEMS器件

基本信息

批准号：
16201027
负责人：
ESASHI Masayoshi
金额：
$ 31.2万
依托单位：
Tohoku University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (A)
财政年份：
2004
资助国家：
日本
起止时间：
2004 至 2006
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-16201027/
关键词：
Micromachining Micromachine Wireless MEMS Sensor Actuator Relay Resonator マイクロマシニング

项目摘要

Three-dimensional microstructures, sensors and actuators can be fabricated on a silicon chip using micromachining which is an extended technology based microfabrication for integrated circuits. RF MEMS (Radio Frequency Micro Electro Mechanical Systems) has been developed to produce RF components for wireless systems. Switches (relays), variable capacitors, micromechanical resonators for time (frequency) references or RF filters, RF interconnection and coils which are fabricated on thin self supported membranes and hence have small stray capacitances can be made by this technology. Following achievements are obtained in this research program.Packaging technologies for the RF MEMS as wafer level packaging processes and electrical feedthrough structures for an electrical interconnection for high speed signal from the top side to the backside of silicon chips were developed. MEMS switches as contact type and capacitive type which are actuated electrostatically were developed.MEMS switches … More were applied for a flexible flat panel display and commercialized as components for high speed LSI testers.Micromechanical resonators can have high resonant frequencies. The extension mode enables higher resonant frequency than the bending mode because of the high spring constant of the extension mode. By making the resonant frequency determined by the lateral dimension multiple resonators with different resonant frequencies can be integrated on a chip. An electrostatically driven wine glass mode silicon disk resonator of witch diameter is 20 μm demonstrated a resonant frequencies of approximately 100 MHz. Since the resonant frequency of such small resonators can be fluctuated by absorbing gas MEMS resonator was fabricated in a vacuum cavity in a silicon chip to stabilize the resonant frequency. Micromechanical resonators have an inherent problem of phase noise caused by thermomechanical noise.The thermomechanical noise also limit the resolution of resonating sensors. Extreme sensitivity is required for MRFM (Magnetic Resonance Force Microscopy) for the MRI (Magnetic Resonance Microscopy) of small samples as biological cell. The noise problems were studied and the phase noise could be reduced by a parametric squeeze damping. Cantilever resonant sensors which have high quality factor in atmosphere were.developed by using quartz material with thickness share mode.High aspect ratio planer coils.were fabricated to reduce the resistance.and high quality factor as high as 85 at 1.6 GHz was achieved for the purpose of the MRI for the small samples. Less

可以使用微加工在硅芯片上制造三维微结构，传感器和执行器，这是用于集成电路的扩展基于技术的微型制造。 RF MEMS（射频微电动机械系统）已开发出来为无线系统生产RF组件。开关（继电器），可变电容器，时间（频率）引用或RF过滤器的微机械谐振器，RF互连和线圈是在薄的自动支撑机制上制造的，因此可以由该技术制成较小的流量电容。在此研究计划中获得了以下成就。RF MEMS的包装技术是摇动级别的包装过程和电馈电结构，用于从硅芯片的顶部到背面的高速信号的电气连接的电源。 MEMS开关作为接触类型和电容类型，它们是通过静电开发的。MEMS开关……更多用于灵活的平板显示屏，并将其作为高速LSI测试仪的组件进行商业化。Micromechanical谐振器可能具有高共振频率。由于扩展模式的高弹簧常数，扩展模式比弯曲模式更高的谐振频率。通过使通过横向尺寸确定具有不同谐振频率的谐振频率可以集成在芯片上。静电驱动的酒玻璃模式硅盘直径为20μm，显示出约100 MHz的谐振频率。由于可以通过吸收气体mems谐振器在硅芯片中的真空腔中制造，因此可以通过吸收气体mems谐振器来波动，以稳定谐振频率。微机械谐振器具有由热机械噪声引起的继承的相位噪声问题。热机械噪声还限制了共振传感器的分辨率。对于小样品作为生物细胞的MRI（磁共振显微镜），需要MRFM（磁共振显微镜）的MRFM（磁共振力显微镜）。研究了噪声问题，可以通过参数挤压阻尼来减少相位噪声。在大气中具有高质量因子的悬臂谐振传感器是通过使用具有厚度共享模式的石英材料来开发的。高宽高比刨花器线圈制造以降低电阻，高质量的高质量在1.6 GHz时为小样品的MRI目的达到了1.6 GHz。较少的