Surface Modification of Aramide Fibers by Radical Shower

芳纶纤维的自由基喷淋表面改性

• 批准号: 06650761
• 负责人: INAGAKI Norihiro
• 金额: $ 1.28万
• 依托单位: Shizuoka University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for General Scientific Research (C)
• 财政年份: 1994
• 资助国家: 日本
• 起止时间: 1994 至 1995
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-06650761/
• 关键词: Aromatic polyamide; Remote plasma; Plalsma treatment; Composite materials; Hydrophilic surface; Surface modification; アラミド; シリコンゴム複合材; 密着力; 親水性表面改質; 低温プラズマ

The surface of aromatic polyamide (Aramide) fibers has been modified to improve adhesion between the polyamide fiber and silicon rubber. Plasma exposure can make Aramide surface hydrophilic, but degradation of Aramide is initiated by electrons and ions bombardment. The degradation involes the bond scission of amide groups and the formation of oligomers of amide, and is troublesome products in the surface modification. A new technique which is called " Remote Plasma Treatment " is proposed for surface modification of Aramide without heavy interactions between polymer surface and electrons or ions. In the remote plasma treatment, the polymer samples are not positioned in the plasma zone, but far from the plasma zone. Radical species in the plasma reach at the sample position, but the electron and ion species do not reach, because of shorter lifetime of the electron and ions than that of the redicals. The advantages of the new surface modification technique by the remote plasma are demonstrated in the surface modidication of poly (tetrafluoroethylene) films and the surface chlorination of polyethylene films. Aramide surface also can be modified from hydrophobic to hydrophilic by the remote plasma. SEM and AFM observations show the surface of Aramide treated with remote plasma is smooth without heavy damage by electron and ion bombardments.

芳香族聚酰胺（Aramide）纤维的表面经过改性，以提高聚酰胺纤维与硅橡胶之间的粘合力。等离子体暴露可以使芳纶表面亲水，但芳纶的降解是由电子和离子轰击引发的。降解涉及酰胺基团的键断裂和酰胺低聚物的形成，是表面改性中的麻烦产物。提出了一种称为“远程等离子体处理”的新技术，用于芳纶表面改性，而聚合物表面与电子或离子之间没有强烈的相互作用。在远程等离子体处理中，聚合物样品不位于等离子体区域，而是远离等离子体区域。等离子体中的自由基物质到达样品位置，但电子和离子物质没有到达，因为电子和离子的寿命比自由基物质短。远程等离子体新型表面改性技术的优势在聚四氟乙烯薄膜的表面改性和聚乙烯薄膜的表面氯化中得到了体现。芳纶表面也可以通过远程等离子体从疏水性改性为亲水性。 SEM 和 AFM 观察表明，经过远程等离子体处理的 Aramide 表面光滑，没有受到电子和离子轰击的严重损坏。

项目成果

N.Inagaki,S.Tasaka,and H.Abe: "Adsorption of Carbon Dioxide in Plasma Polymers prepared from Silicon Compounds and Carbon Dioxide Separation Membrane" Polymer Bulletin. 33. 709-715 (1994)

N.Inagaki、S.Tasaka 和 H.Abe：“由硅化合物和二氧化碳分离膜制备的等离子体聚合物中二氧化碳的吸附”聚合物通报。

稲垣訓宏: "共立出版" 高分子の物性3、第4章 表面・界面の改質, 29 (1995)

Norihiro Inagaki：“Kyoritsu Shuppan”聚合物的物理性质 3，第 4 章表面和界面的改性，29 (1995)

N.Inagaki, S.Tasaka, and M.Matsumoto: "Plasma graft polymerization of vinylimidazole onto kapton film surface for improvement of adhesion between Kapton film and copper" J.Appl.Polym.Sci.vol.56. 135-145 (1995)

N.Inagaki、S.Tasaka 和 M.Matsumoto：“乙烯基咪唑在 Kapton 薄膜表面上的等离子体接枝聚合，以改善 Kapton 薄膜与铜之间的粘附力”J.Appl.Polym.Sci.vol.56。

山田泰美、田坂 茂、稲垣訓宏: "SiOx薄膜合成におけるリモート酸素プラズマの効果" 高分子論文集. 53. 33-40 (1996)

Yasumi Yamada、Shigeru Tasaka、Norihiro Inagaki：“远程氧等离子体对 SiOx 薄膜合成的影响”《聚合物研究杂志》53. 33-40 (1996)。

N.Inagaki,S.Tasaka,and K.Hibi: "Improved Adhesion between Plasma-treated Polyimide Film and evaporated Copper" Journal of Adhesion Scienc&Technology. 8. 395-410 (1994)

N.Inagaki、S.Tasaka 和 K.Hibi：“等离子体处理的聚酰亚胺薄膜和蒸发铜之间的粘合力得到改善”《粘合科学杂志》