"Evaluation of Three-Dimensional Residual Stress in Bonding Layr with Polarized Laser"

“用偏振激光评估键合层的三维残余应力”

• 批准号: 05805010
• 负责人: NIITSU Yasushi
• 金额: $ 1.28万
• 依托单位: TOKYO DENKI UNIVERSITY
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for General Scientific Research (C)
• 财政年份: 1993
• 资助国家: 日本
• 起止时间: 1993 至 1994
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-05805010/
• 关键词: Experimental Stress Analysis; Photoelasticity; Three dimensional Stress Analysis; Adhesive Bonding; Residual Stress; 応力分布計測; 接着; 光弾性実験; 三次元応力; 光弾性変調器

Optical birefringence was measured by a high frequency modulation method using a photoelastic modulator and a polarized laser. This measurement has the high sensitivity required to measure small birefringence produced by stress. The following results were obtained with developed measurement.(1) The optical birefringence distributions were measured for the bonded rectangular glass plates with epoxy resin. With those results, the residual stress distribution in adhesive layr caused by the bonding process was evaluated. Consequently, the maximum tensile stress applied at the side and corner, and the biaxial tension applied at the inside.(2) The new synthesized photoelastic method was developed for calculation of stress and its direction with laser potoelasticity measurement. The distributions of optical birefringence corresponding to stress were measured for the tensile glass plates with a hole and notches. Measured stress distributions agreed well with the FEM analysis, and it was confirmed that the new method would be useful to detect the microscopical stress fields.(3) I tried to evaluate the three dimensional stress distribution from two dimensional its projection. But it was difficult analytically. The combination of FEM and experimental results has possibility of three dimensional stress evaluation.

通过使用光弹性调制器和极化激光器的高频调制方法测量光学双折射。该测量具有测量压力产生的小双折射所需的高灵敏度。通过开发的测量获得以下结果。（1）针对带有环氧树脂的粘合矩形玻璃板测量光学双折射分布。通过这些结果，评估了由粘结过程引起的粘合剂层中的残余应力分布。因此，在侧面和角处施加的最大拉伸应力，并在内部施加的双轴张力。（2）开发了新的合成光弹性方法，用于计算应力及其方向，并使用激光poto弹性测量。用孔和凹槽的拉伸玻璃板测量了与应力相对应的光学双折射的分布。测得的应力分布与FEM分析非常吻合，并且已经证实，新方法对于检测显微镜应力场很有用。（3）我试图评估从二维的投影中评估三维应力分布。但这在分析上很困难。 FEM和实验结果的组合具有三维应力评估的可能性。

项目成果

Yasusi NIITSU: "Micro-stress Measurement by Laser Photoelasticity" Mech. and Materials for Electronic Packaging. AMD-Vol.187. 29-35 (1994)

Yasusi NIITSU：“激光光弹性微应力测量”机械。

一瀬謙輔: "複屈折を利用した接着層内残留応力発生の計測と評価" 東京電機大学総合研究所年報. 1993-1994 No.13. 43-48 (1994)

Kensuke Ichinose：“使用双折射测量和评估粘合层中残余应力的产生”，东京电机大学研究所年度报告 1993-1994 年第 13 期（1994 年）。

新津 靖: "透過偏光レーザを用いた透明材料の応力分布計測法" 日本非破壊検査協会第4分科会資料. 4893. 25-31 (1993)

Yasushi Niitsu：“使用透射偏振激光的透明材料中的应力分布的测量方法”日本无损检查协会第4次材料委员会4893.25-31（1993）。

一瀬謙輔、新津靖: "複屈折を利用した接着層内残留応力発生の計測と評価" 東京電機大学総合研究所年報. No.13. 43-48 (1994)

Kensuke Ichinose、Yasushi Niitsu：“使用双折射测量和评估粘合剂层中残余应力的产生”，东京电机大学研究所年报第 13. 43-48 号（1994 年）。

Yasusi NIITSU: "A Stress Measuring Method by Polarized Laser and Photo-Elastic Modulator" Proc. Int. Electronics Packaging Conference. 1993 Vol.1. 157-161 (1993)

Yasusi NIITSU：“偏振激光和光弹性调制器的应力测量方法”Proc。