Fiber-Wireless-Fiber Fully Integrated D-Band System (FiWiFi)
光纤-无线-光纤完全集成的 D 频段系统 (FiWiFi)
基本信息
- 批准号:427778912
- 负责人:
- 金额:--
- 依托单位:
- 依托单位国家:德国
- 项目类别:Research Grants
- 财政年份:
- 资助国家:德国
- 起止时间:
- 项目状态:未结题
- 来源:
- 关键词:
项目摘要
Current opto-electronic wireless bridges consist of hybrid systems where optical and electronic parts are different MMICs packaged through micro-wires or flip-chip bonding and communicating each other through a mother board where the antenna finds place. This reflects mostly into losses and bandwidth reduction, limiting the performance in terms of wireless link speed. This proposal aims to overcome those practical problems through a full integration onto a single chip of the entire chain, from the fiber to the antenna. In particular, the project aims at exploiting a new technology platform by IHP allowing the integration of high-speed optical components as photodiodes and Mach-Zehnder modulators, high rf-circuits as mixers and amplifiers and on-chip LBE-based antennas. The proposal aims at exploiting the new technological feature of structuring the metallic layer on top of the silicon bulk in combination with localized backside etching of the bulk.Considering the typical data-rate within fibers in a data center the technological frequency limits and the antenna size, the D-Band has been selected. The wide frequency band between 110 and 170 GHz from one side allows very high data-rates, but from the other pushes to the limit the design of electronic circuits, optical components and antennas. The following main objectives are addressed:• Opto-electronic transmitter and receiver speed: the speed of the current versions of both opto-electronic receiver and transmitter is not yet enough to support the desired bandwidth. Faster TIAs and MZM’s drivers will be designed.• Transceiver and antenna bandwidth: The 60 GHz bandwidth centered at 140 GHz results in 43% relative bandwidth. On top of that, the D-Band is very close to the technological frequency limits. • Communication distance: The targeted application requires a wireless link up to some meters. Given the high free space path loss at the selected frequency band, the limited achievable output power and noise figure and the low typical gain of on-chip antennas, such a distance turns to be very challenging. The applicants address all the mentioned challenges by proposing a fully integrated two-chip approach, where a Tx and a Rx chip communicate wirelessly. The main strength of this system is the full integration, from the fiber to the antenna on the Tx side and vice versa. With the help of self-complimentary multimode antennas, sufficient antenna gains at simultaneously large bandwidth in various directions of radiation are aimed at, realized by antennas exploiting the new technological feature of the combination of localized backside etching and a structured metallic layer on top of the silicon bulk.
当前的电气锻炼系统是通过ES包装的光学和电子零件不同的MMIC,或者通过天线找到的Amoth板包装其他板。通过完全集成到轮胎链的芯片,尤其是从纤维到天线,该项目旨在通过IHP提出一个新的技术平台,从而允许整合高速光学曲折编码器基于LBE的天线。选择的。两个光电接收器和发射器的速度不足以支持所需的带宽。最重要的是,我接近技术频率限制。通过促进完全集成的两芯片方法,TX和RX芯片无线通信。在硅大块顶部的结构化金属层处。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Professor Dr.-Ing. Dietmar Kissinger其他文献
Professor Dr.-Ing. Dietmar Kissinger的其他文献
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{{ truncateString('Professor Dr.-Ing. Dietmar Kissinger', 18)}}的其他基金
Flexible Electronic-Photonic Integrated Circuit Sensor Platform II [EPIC-Sense II]
柔性电子光子集成电路传感器平台II [EPIC-Sense II]
- 批准号:
403154513 - 财政年份:2018
- 资助金额:
-- - 项目类别:
Priority Programmes
Hybrid Phased Array Antenna System for High Data Rate mm-Wave Wireless Communication (HyPAA)
用于高数据速率毫米波无线通信的混合相控阵天线系统 (HyPAA)
- 批准号:
320392473 - 财政年份:2016
- 资助金额:
-- - 项目类别:
Research Grants
Integrated Lab-on-Chip Terahertz-Spectroscopy Platform in BiCMOS Technology II (THz-LoC II)
采用 BiCMOS 技术 II (THz-LoC II) 的集成片上实验室太赫兹光谱平台
- 批准号:
272552499 - 财政年份:2015
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-- - 项目类别:
Priority Programmes
Electronic-Photonic Integrated Circuits for Wireless THz Communication [EPIC-COM]
用于无线太赫兹通信的电子光子集成电路 [EPIC-COM]
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528867461 - 财政年份:
- 资助金额:
-- - 项目类别:
Research Grants
Active Millimeter-Wave On-Wafer Measurement Probe
有源毫米波晶圆上测量探头
- 批准号:
446397162 - 财政年份:
- 资助金额:
-- - 项目类别:
Research Grants
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