Development of High Performance Copper-base Shape Memory Alloys by means of Rapid Solidification.

利用快速凝固技术开发高性能铜基形状记忆合金。

基本信息

批准号：
60850133
负责人：
MURAKAMI Yotaro
金额：
$ 6.08万
依托单位：
Faculty of Engineering, Kansai University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Developmental Scientific Research
财政年份：
1985
资助国家：
日本
起止时间：
1985 至 1986
项目状态：
已结题

项目摘要

Although Cu-base shape memory alloys (SMA) have the large potential to be used as new functional materials owing to a lower price compared with that of the Ni-Ti SMA, the application seems to be limited by the reason that ordinary polycrystalline materials have a rather low ductility in case of a coarse grain structure, which may be an inherent property of these alloy systems.The present investigation has been carried out to improve a ductility in Cu-Al-Ni-Mn SMA by grain refinement using a rapid solidification techniques combined with powder metallurgy(P/M) method. At the same time, it has been also made to develope the technological method of controlling transformation temperatures of SMA by P/M method, which consists of mixing the two kinds of standerd alloys with the definite transformation temperature.It was found that the addition of 1% Ti and 0.2%V to 4032III alloy developed by the research group of Kansai University was most effective to obtain the small grain size such as 3-4 <mu> m even after annealing for 30 min at 900゜C in the specimen prepared by RSP-P/M. These specimens showed a fairly improved hot and cold deformability together with a good SM effect. However, the transformation temperatures were found to be affected considerably due to the grain size with the order of several micron metres as well as the fine distribution of the compounds, which plays an important role for restriction to grain growth during annearing. The method of controlling the transformation temperatures of SAM has been established by RSP-P/M using the two previously prepared RSP, which has the difinit transformation temperature. These specimen showed to have agood ductility by SEM fractograpy.

尽管铜基形状记忆合金（SMA）由于价格低于镍钛形状记忆合金（Ni-Ti SMA）而具有作为新型功能材料的巨大潜力，但由于普通多晶材料的性能较差，其应用似乎受到限制。在粗晶粒结构的情况下，延展性相当低，这可能是这些合金系统的固有特性。目前的研究是通过使用快速凝固的晶粒细化来提高 Cu-Al-Ni-Mn SMA 的延展性技巧与粉末冶金（P/M）法相结合，同时还开发了用P/M法控制SMA相变温度的工艺方法，即将两种标准合金与粉末冶金法混合。研究发现，在关西大学研究组开发的4032III合金中添加1%Ti和0.2%V对于获得小晶粒尺寸（甚至3-4μm）最为有效通过 RSP-P/M 制备的样品在 900°C 下退火 30 分钟后，这些样品表现出相当改善的热变形能力和良好的 SM 效果，但是，由于以下原因，转变温度受到很大影响。数微米量级的晶粒尺寸以及化合物的精细分布，对限制退火过程中的晶粒长大具有重要作用。建立了控制SAM相变温度的方法。 RSP-P/M 使用先前制备的两种 RSP，其具有明确的转变温度，这些样品通过 SEM 断口分析显示具有良好的延展性。