SBIR Phase I: Innovative Solid-State Phase Change Cooling to Supercharge Central Processing Unit (CPU) Performance

SBIR 第一阶段：创新固态相变冷却，增强中央处理器 (CPU) 性能

• 批准号: 2322115
• 负责人: Asher Leff
• 金额: $ 27.5万
• 依托单位: TAUMAT LLC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-09-01 至 2024-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2322115&HistoricalAwards=false
• 关键词: SBIR; Phase; Innovative; Solid; State

The broader impact/commercial potential of this Small Business Innovation Research Phase I project aims to establish a new approach to high-performance central processing unit (CPU) thermal management that focuses on the development and application of innovative solid-solid thermal energy storage (TES) materials and hardware. Increasingly, steady-state cooling solutions are unable to keep up with the required operating frequencies and resulting thermal loads of temperature-sensitive computing and electronic components. As a result, these components are throttled down to reduce heating. This results in the desired temperature reduction but inevitably leads to clock speed and performance reductions as well. The proposed project aims to challenge this existing tradeoff and produce CPU heat sinks that can maintain 3X computational performance ‘sprints’ with no added weight/volume nor electrical energy expenditure, in a scalable and easily deployable, drop-in form factor. Fueled by a global demand for high-performance computing, internet-of-things, and handheld electronics, the market for high-performance CPU coolers is rising with a market size of about $2.04 billion and a compound annual growth rate of 3.73-4.64% over the next decade. The target solid-solid TES heatsink is transferable to battery fast charging, system-on-chip devices, and the power electronic market.The intellectual merit of this project resides in newly-identified thermal energy storage materials to shift the paradigm in CPU cooler design away from simply maximizing steady-state heat dissipation towards an optimized approach that combines high steady-state dissipation with high-capacity thermal storage. This Phase I project has three primary research objectives: i) develop analytical and numerical topology optimization approaches to identify ideal thermal energy storage material properties and composite heat transfer/capacity structures for CPU applications: ii) leverage data-driven shape memory alloy discovery using an artificial intelligence framework to identify and ultimately arc-melt new thermal energy storage materials that exhibit high-latent heat, high-conductivity, low hysteresis, and/or the ideal combination of material properties based on CPU requirements: and iii) design, fabricate, and test prototypes for model validation and concept demonstration. These technical efforts, combined with risk reduction and mitigation steps, and techno-economic and manufacturing analysis will enable leap-ahead improvements in an ever-expanding array of high-power, thermally limited applications.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

该小企业创新研究第一阶段项目的更广泛影响/商业潜力旨在建立一种高性能中央处理器（CPU）热管理的新方法，重点关注创新型固-固热能存储（TES）的开发和应用）材料和硬件。稳态冷却解决方案越来越无法满足温度敏感计算和电子组件所需的工作频率和由此产生的热负载，因此，这些组件被限制以减少热量。期望的温度降低，但不可避免地导致提议的项目旨在挑战这种现有的权衡，并生产能够在不增加重量/体积或电能消耗的情况下保持 3 倍计算性能“冲刺”的 CPU 散热器，并以可扩展且易于部署的方式进行。在全球对高性能计算、物联网和手持电子产品需求的推动下，高性能 CPU 冷却器市场正在不断增长，市场规模约为 20.4 亿美元，复合年增长率为未来十年增长率为 3.73-4.64% 目标固-固 TES 散热器可转移到电池快速充电、片上系统设备和电力电子市场。该项目的智能优势在于新发现的。热能存储材料将 CPU 冷却器设计的范式从简单地最大化稳态散热转向将高稳态散热与高容量热存储相结合的优化方法。该第一阶段项目有三个。主要研究目标：i) 开发分析和数值拓扑优化方法，以确定 CPU 应用的理想热能存储材料特性和复合传热/容量结构：ii) 利用人工智能框架，利用数据驱动的形状记忆合金发现来识别和最终电弧熔化新型热能存储材料，这些材料具有高潜热、高传导性、低滞后性和/或基于 CPU 要求的材料特性的理想组合：以及 iii) 设计、制造和测试原型以进行模型验证和概念演示。这些技术努力，加上风险降低和缓解措施，以及技术经济和制造分析，将在不断扩大的高功率、热限制应用领域中实现飞跃。该奖项反映了 NSF 法定使命的改进，并已通过使用基金会的智力优点和更广泛的影响审查标准进行评估，认为值得支持。