Conference: The First International Symposium on Integrated Magnetics (iSIM-1)

会议：第一届国际集成磁学研讨会（iSIM-1）

• 批准号: 2309935
• 负责人: Nian Sun
• 金额: $ 1.5万
• 依托单位: Northeastern University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-03-01 至 2024-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2309935&HistoricalAwards=false
• 关键词: Conference; First; International; Symposium; Integrated

With the rapid progress in the research and development of magnetic materials, devices, and microsystems for sensors, memories, power, radio frequency, microwave, and millimeter wave electronics, there are great new opportunities for integrated magnetics in IoT, 5G, smartphones, etc. The iSIM (International Symposium on Integrated Magnetics) series are started to serve the fast-growing needs of the IEEE Magnetics Society to reach out to other IEEE societies and industries and bring the science and technology on magnetics to the market and the public. The iSIM will foster scientific discussion and catalyze innovation and partnerships to significantly enhance our understanding of the challenges and potential solutions to integrating magnetic materials on Si substrates and PCBs (print circuit boards). The iSIM-1, and the future annual iSIM symposiums, will call attention to the IEEE Magnetics Society and the public on the topics of integrated magnetics. Integrated magnetics is a key topic for semiconductor technologies, well aligned with The CHIPS and Science Act, a national strategic and historic investment to surge production of American-made semiconductors, tackle supply chain vulnerabilities to make more goods in America, revitalize America’s scientific research and technological leadership, and strengthens America’s economic and national security at home and abroad. Magnetic materials on Si and on PCBs, if realized, can lead to magnetic inductors and transformers on-chip or in package with significantly reduced sizes and costs, and improved performance. Despite the significant progress of research on magnetic materials and devices, integrated magnetic inductors and transformers have not been applied on commercial RFICs (radio frequency integrated circuits), and rarely on power integrated circuits. Surface mount discrete components are widely used in power management circuits and RFICs, leading to significant costs and sizes, etc. There is a critical need for a symposium on integrated magnetics such as iSIM. The proposed iSIM-1 will be the first satellite symposium being organized for May 14-15, 2023, in conjunction with the IEEE International Magnetics Conference (INTERMAG) 2023 in Sendai, Japan, being held from May 15 ~ 19, 2023. INTERMAG is the premier international conference on fundamental and applied magnetism but has limited bandwidth to cover topics on integrated magnetics. The iSIM-1 will be at the same venue as the INTERMAG 2023, with focused coverage on topics for integrated magnetics for power supply on chip (PWRSOC), power supply in package (PWRSIP), RFICs, on-chip magnetic sensors, flexible magnetic electronics, magnetic memory, etc. It is expected that the iSIM will be held continuously every year as a satellite symposium of the future INTERMAG conferences. A key output of iSIM-1 will be high-impact, multi-disciplinary position papers with direct implications for integrated magnetics. The iSIM-1 will foster discussion and identify innovations for the next frontier of magnetic materials and devices for integrated circuits, on-chip magnetic sensors, flexible magnetic electronics, magnetic memory, etc. At the same time, iSIM-1 will provide ample training opportunities for U.S. nationals with a focus on underrepresented groups, including women and minority students.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

随着传感器、存储器、电源、射频、微波和毫米波电子领域磁性材料、器件和微系统研发的快速进展，集成磁学在物联网、5G、智能手机等领域存在巨大的新机遇iSIM（国际集成磁学研讨会）系列的启动是为了满足 IEEE 磁学协会快速增长的需求，以接触其他 IEEE 学会和行业，并将磁学科学技术推向市场和行业。 iSIM 将促进科学讨论并促进创新和合作，以显着增强我们对在硅基板和 PCB（印刷电路板）上集成磁性材料的挑战和潜在解决方案的理解，以及未来的年度 iSIM 研讨会。 ，将引起 IEEE 磁学协会和公众对集成磁学主题的关注 集成磁学是半导体技术的一个关键主题，与《CHIPS 和科学法案》（一项旨在提高产量的国家战略和历史性投资）完全一致。硅和多氯联苯磁性材料如果实现的话，可以领先美国制造的半导体，解决供应链漏洞，在美国生产更多商品，重振美国的科学研究和技术领先地位，并加强美国在国内外的经济和国家安全。尽管磁性材料和器件的研究取得了重大进展，但集成磁性电感器和变压器尚未应用于商业化。 RFIC（射频集成电路），很少用于功率集成电路。表面贴装分立元件广泛用于电源管理电路和RFIC，导致成本和尺寸显着增加等。因此迫切需要举办关于集成磁学的研讨会。拟议的 iSIM-1 将于 2023 年 5 月 14 日至 15 日与 IEEE 国际磁学会议 (INTERMAG) 联合举办。 2023 年在日本仙台，将于 2023 年 5 月 15 日至 19 日举行。INTERMAG 是基础和应用磁学领域的顶级国际会议，但涵盖集成磁学主题的带宽有限。iSIM-1 将与 2023 年在同一地点举行。 INTERMAG 2023，重点涵盖片上电源集成磁性器件 (PWRSOC)、封装电源 (PWRSIP)、RFIC、预计iSIM将作为未来INTERMAG会议的卫星研讨会每年连续举办，iSIM-1的主要成果将是具有高影响力、 iSIM-1 对集成磁学具有直接影响的多学科立场文件将促进讨论并确定集成电路、片上磁传感器、柔性磁电子学、磁存储器等磁性材料和设备的下一个前沿领域的创新。同时，iSIM-1将为美国国民提供充足的培训机会，重点关注女性和少数族裔学生等弱势群体。该奖项履行了NSF的法定使命，并通过使用基金会的智力优势进行评估，认为值得支持以及更广泛的影响审查标准。