Collaborative Research: Development of a Nanofabrication Lab Manual Featuring a Suite of Low-Cost Experiments to Enable Hands-On Training at Community and Technical Colleges

合作研究：开发纳米制造实验室手册，其中包含一套低成本实验，可在社区和技术学院进行实践培训

• 批准号: 2301137
• 负责人: Zachary Gray
• 金额: $ 54.34万
• 依托单位: Pennsylvania State Univ University Park
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-10-01 至 2026-09-30
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2301137&HistoricalAwards=false
• 关键词: Collaborative; Research; Development; Nanofabrication; Lab

Semiconductors in the form of integrated circuits (ICs), or chips, are an integral part of our technology-driven world. The need for chips has risen sharply while the supply has fallen short of the demand worldwide. Before the end of the last century the United States (US) led the world in chipmaking. However, the US now provides less than 10% of the world need, and the leadership of chip supply is dominated by other countries. Semiconductor products are critical to our economic and national security and rank the fifth largest US export sector providing approximately 250,000 jobs in the United States. This project will explore an innovative way to increase the chipmaking workforce numbers required to meet this national need by eliminating the expensive and complex infrastructure (e.g., cleanrooms, fabrication equipment) traditionally required to train and educate individuals in this area. This project will develop a lab manual featuring low-cost experiments that closely represent the methods used in the chipmaking industry. The manual will feature experiments for students to demonstrate their learning in a hands-on fashion. The lessons in the manual will specifically be designed to be transferrable to any community college (CC) seeking to offer degree tracks in micro and nanotechnology (i.e., chipmaking) to dynamically meet the local industry demand. Instructor guides will include student assessment rubrics to measure learning outcomes. After development, partnering CC’s will review the manual and evaluate the experiments. The manual will be further optimized and evaluated before widespread dissemination through national conferences and professional development activities. This manual will be used as both an outreach tool and a training resource to help cultivate and develop the workforce required to fill the US chipmaking sector. This project, in response to the Enhancing Engineering Technology and Advanced Semiconductor Manufacturing Technician Education Dear Colleague Letter (22-120), is funded by the Advanced Technological Education program that focuses on the education of technicians for the advanced-technology fields that drive the Nation's economy.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

集成电路（IC）或芯片形式的半导体是我们这个技术驱动的世界的一个组成部分，在上世纪末之前，对芯片的需求急剧增加，而供应量却供不应求。美国在芯片制造方面处于世界领先地位，但目前美国的芯片供应量仅占全球需求的不到10%，而半导体产品对我们的经济和国家安全至关重要。排名第五该项目将探索一种创新方法，通过消除传统上所需的昂贵且复杂的基础设施（例如洁净室、制造设备）来增加满足这一国家需求所需的芯片制造劳动力数量。该项目将开发一本以低成本实验为特色的实验室手册，该手册将通过实验让学生以实践的方式展示他们的学习成果。在手册将专门设计为可转移到任何寻求提供微米和纳米技术（即芯片制造）学位课程的社区学院，以动态满足当地行业需求。教师指南将包括学生评估标准，以衡量学习成果。在通过全国会议和专业发展活动广泛传播之前，合作伙伴 CC 将审查该手册并评估实验。该手册将用作帮助培养的外展工具和培训资源。并培养填补美国芯片制造行业所需的劳动力。该项目是为了响应《加强工程技术和先进半导体制造技术人员教育亲爱同事的信》(22-120)，由专注于教育的先进技术教育计划资助。该奖项反映了 NSF 的法定使命，并通过使用基金会的智力价值和更广泛的影响审查标准进行评估，被认为值得支持。