I-Corps: Reducing medical adhesive-related skin injuries while using high-adhesion tape

I-Corps：使用高粘性胶带减少医疗粘合剂相关的皮肤损伤

• 批准号: 2149741
• 负责人: Eric Seibel
• 金额: $ 5万
• 依托单位: University of Washington
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2022
• 资助国家: 美国
• 起止时间: 2022-01-15 至 2022-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2149741&HistoricalAwards=false
• 关键词: Corps; Reducing; medical; adhesive; related

The broader impact/commercial potential of this I-Corps project is the development of a high-adhesion medical tape that may be removed in seconds without skin injury. The proposed technology may be especially beneficial for children and elderly because they have thinner and more fragile skin. Medical tape is used to hold essential devices to the skin for long periods of time. Unfortunately, without means for safe removal, these strong adhesive tapes are painful to remove from the skin, often resulting in medical adhesive-related skin injuries (MARSI). Medical tape that offers high adhesion while providing means for safe removal may gain immediate traction in children’s hospitals. The proposed high-adhesion medical tape is designed to release from skin upon warming with a heat pack. The proposed technology may lead to commercialization of a novel medical tape that would affect patients and caregivers worldwide, leading to reductions of pain felt by patients and anxiety experienced by both patients and caregivers. In addition, there are other potential commercial applications outside of healthcare that benefit from heat-responsive adhesives, making for an expansive global market.This I-Corps project is based on the development of a temperature responsive adhesive that may be manufactured into high adhesion tapes and labels. The plan is to formulate a variety of temperature sensitive polymers (TSPs) and incorporate them into the pressure sensitive adhesive (PSA) so when the mixture reaches 43°C, the tape loses most of its adhesion. Based on the makeup of the proposed PSA, certain TSP characteristics make these polymers compatible with the PSA. One TSP has been tested and the goal is to test others to understand how these various TSPs interact with a PSA system, and the mechanism for peel force reduction. Initial data on one TSP formulation has shown a 75% decrease in peel force after heating with a heat pack approved for human use. Since these additives are expected to create new classes of skin-safe heat-releasing adhesive bandages, performance will be optimized by understanding their temperature-responsive performance mechanisms during use and preserving functionality during storage/shipping to choose the best candidates for future products. By comparing three distinctly different additives, mechanisms of action will be determined by means of analytical surface analysis, atomic force microscopy (AFM), and peel force measurements.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

该I-Corps项目的更广泛的影响/商业潜力是开发高粘附医用胶带，可以在几秒钟内无皮肤损伤去除。拟议的技术可能对儿童和年龄较大的孩子特别有益，因为他们的皮肤较薄，更脆弱。医用胶带长时间用来将必需的设备固定在皮肤上。不幸的是，这些坚固的粘合胶带没有安全去除的含义，可以从皮肤上切除，通常会导致医学上与粘合剂相关的皮肤损伤（Marsi）。提供高粘合剂的医疗胶带在提供安全拆除的手段的同时可以立即在儿童医院中获得牵引力。拟议的高粘合医用胶带旨在用热包变暖后从皮肤上释放出来。提出的技术可能会导致一种新型的医用胶带商业化，该录像带将影响全球患者和看护人，从而减轻患者和患者和看护者所经历的疼痛和焦虑。此外，医疗保健以外的其他潜在商业应用会受益于热响应性粘合剂，从而为全球广泛的市场带来了。此I-Corps项目基于温度响应粘合剂的开发，可以将其制造成高粘合剂胶带和标签。该计划是形成各种温度敏感的聚合物（TSP），并将其掺入压力敏感的粘合剂（PSA）中，因此当混合物达到43°C时，胶带会失去大部分粘合剂。基于提出的PSA的构成，某些TSP特性使这些聚合物与PSA兼容。已经测试过一个TSP，目标是测试其他TSP，以了解这些各种TSP如何与PSA系统相互作用，以及降低峰值力的机制。一个TSP形成的初始数据显示，用批准用于人类使用的热包加热后峰值力量下降了75％。由于这些上瘾者有望创建新的皮肤安全热粘合剂绷带，因此可以通过了解其在使用过程中的温度响应性能机制来优化性能，并在存储/运输过程中保留功能，以选择未来产品的最佳候选者。通过比较三种截然不同的添加剂，将通过分析表面分析，原子力显微镜（AFM）和Peel Force测量的方式来确定作用机制。该奖项反映了NSF的法定任务，并被认为是通过基金会的知识分子优点和更广泛影响的审查标准来通过评估而被视为珍贵的支持。