PFI:AIR - TT: RelMaster: Towards a Reliability Simulation Toolset

PFI:AIR - TT：RelMaster：迈向可靠性仿真工具集

基本信息

批准号：
1700914
负责人：
Linda Milor
金额：
$ 20万
依托单位：
Georgia Tech Research Corporation
依托单位国家：
美国
项目类别：
Standard Grant
财政年份：
2017
资助国家：
美国
起止时间：
2017-07-15 至 2020-06-30
项目状态：
已结题

来源：
https://www.nsf.gov/awardsearch/showAward?AWD_ID=1700914&HistoricalAwards=false
关键词：
PFI AIR TT RelMaster Towards

项目摘要

This PFI: AIR Technology Translation project focuses on translating semiconductor reliability simulation technology to fill the need to estimate lifetimes of high-reliability projects. This is especially important in the aeronautics, automotive, medical, and space segments of the semiconductor industry because these products must achieve lifetimes well beyond those for which the technology used for their manufacturing was designed. The reliability simulation software will lower the cost and time-to-market of high reliability semiconductor products by mitigating the risk of circuit failures of accelerated lifetime tests, which are performed immediately prior to releasing a product to market. When a circuit fails accelerated lifetime tests, it must be re-designed and re-manufactured prior to release to the marketplace, at a cost of hundreds of millions of dollars. This project will result in a minimum viable product, which is software for a lifetime check for semiconductor circuits. This semiconductor reliability simulation technology has the following unique features: the software works at the system level, covers both front-of-line and back-of-line wearout mechanisms, and can incorporate customer-defined use scenarios. These features provide a more complete solution to the wearout simulation problem when compared with the leading competing reliability simulation software in the market space (covering only device-level aging incorporated in device models). This project addresses the following technology gaps as it translates from research discovery toward commercial application. The work incorporates three tasks, a comparison with standard industrial methodologies, calibration techniques for adjusting models to experimental data, and refinement of the simulation methodologies to enable scalability to large industrial designs. Approaches include the use of accelerated tests for circuits, where test conditions are selected to isolate each wearout mechanism, so that failures due to a wide variety of wearout mechanisms can be observed, unlike industrial standard practice. Scalability to large-scale designs will be demonstrated after development of methods to incorporate steps in the existing design flow and automation. The goal is to demonstrate a reasonable computational cost and minimal impact on time-to-tapeout. In addition, personnel involved in this project (Ph.D. students) will receive innovation/entrepreneurship/technology translation training through working with the project's business mentor, Jonathan Goldman. This project engages Aeroflex Corporation to demonstrate calibration of the experimental data to simulation results in this technology translation effort from research discovery towards commercial reality.

该PFI：空气技术翻译项目的重点是翻译半导体可靠性模拟技术，以填补估计高可靠性项目的生命的需求。这在半导体行业的航空，汽车，医疗和空间段中尤其重要，因为这些产品必须超越设计其制造技术的技术的生命值。可靠性仿真软件将通过减轻加速终身测试的电路故障的风险来降低高可靠性半导体产品的成本和时间，这些风险在将产品发布到市场之前就立即执行。当电路未能加速终身测试时，必须在发布到市场之前重新设计和重新制造，费用为数亿美元。该项目将导致最低可行的产品，这是半导体电路终生检查的软件。该半导体可靠性仿真技术具有以下独特功能：该软件在系统级别上工作，涵盖线路和背面的磨损机制，并且可以结合客户定义的使用情况。与市场空间中领先的竞争可靠性仿真软件相比，这些功能为磨损模拟问题提供了更完整的解决方案（仅涵盖设备模型中的设备级老化）。该项目解决了以下技术差距，因为它从研究发现转化为商业应用。这项工作结合了三个任务，与标准工业方法的比较，用于调整模型到实验数据的校准技术以及模拟方法的细化，以实现对大型工业设计的可扩展性。方法包括在电路中使用加速测试，其中选择了测试条件以隔离每个磨损机制，因此可以观察到由于工业标准实践而导致的各种磨损机制导致的故障。在开发方法将步骤合并到现有设计流和自动化中后，将证明对大规模设计的可伸缩性。目的是证明合理的计算成本，并最小化对时间拍摄的影响。此外，参与该项目的人员（Ph.D.学生）将通过与该项目的商业导师Jonathan Goldman合作，将获得创新/创业/技术翻译培训。该项目与Aeroflex Corporation互动，以证明对实验数据的校准，以导致从研究发现到商业现实的技术翻译工作。