PFI:AIR - TT: Scalable Accelerated Power Simulation Program with Integrated Circuit Emphasis

PFI:AIR - TT：以集成电路为重点的可扩展加速功率仿真程序

• 批准号: 1700844
• 负责人: Young Cho
• 金额: $ 20万
• 依托单位: University of Southern California
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2017
• 资助国家: 美国
• 起止时间: 2017-07-01 至 2018-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1700844&HistoricalAwards=false
• 关键词: PFI; AIR; TT; Scalable; Accelerated; PFI; AIR; TT; Scalable; Accelerated

This PFI: AIR Technology Translation project focuses on translating a novel integrated circuit (IC) power estimation simulation technology into an integrated simulation tool that is superior to the current state-of-the-art. The Scalable Accelerated Power Simulation Program with Integrated Circuit Emphasis (SAP-SPICE) will drastically improve the way IC manufacturers design, fabricate, and test modern chips by significantly increasing the speed and the accuracy of the power estimation simulations. This project addresses the following technology gap as it translates from research discovery toward commercial application. While the gold-standard simulation tool HSPICE produces the most accurate result, it comes at a high computational cost. On the other hand, accelerated simulators are faster because they depend on larger component models but they produce less accurate average results. The SAP-SPICE project uses a different approach with logic design, a logic simulator, and a portion of power data to extract a more accurate result while maintaining fast computational speed. The goal of this project is to produce a preproduction quality prototype that will integrate with existing industry standard tools to demonstrate the advantages of the technology over other tools to potential customers. The SAP-SPICE will have broader impacts on several fronts. First, the tool can lead to significant societal and environmental benefit when it is used by the chip manufacturers to improve the chip yield. Second, the techniques developed for the product have potential broader applicability to other areas of computing such as large server systems, mobile devices, and consumer appliances; especially in a future where a fine-grained energy accounting will be an integral part of all computing devices. Beyond its impact on technology, the project will also contribute to workforce development through educational benefits to the students participating in the project who will be organized in a structure similar to a small business, encouraged to find innovative solutions on a short timeline, and will meet weekly with the business mentor.

该PFI：空气技术翻译项目的重点是将新颖的集成电路（IC）功率估计模拟技术转换为一个比当前最新的集成模拟工具。 具有集成电路重点（SAP-SPICE）的可扩展加速功率模拟程序将通过显着提高电源估计模拟的速度和准确性，从而大大改善IC制造商设计，制造和测试现代芯片的方式。 该项目解决了以下技术差距，因为它从研究发现转化为商业应用。 尽管金标准模拟工具HSpice产生最准确的结果，但它的计算成本很高。 另一方面，加速模拟器的速度更快，因为它们取决于较大的组件模型，但会产生较少准确的平均结果。 SAP-SPICE项目使用逻辑设计，逻辑模拟器和一部分功率数据的不同方法来提取更准确的结果，同时保持快速的计算速度。 该项目的目的是生产一个预生产质量原型，该原型将与现有的行业标准工具集成，以证明该技术的优势而不是其他工具向潜在客户。 SAP-Spice将对多个方面产生更大的影响。首先，当芯片制造商使用该工具以提高芯片产量时，该工具可能会带来重大的社会和环境利益。其次，为产品开发的技术具有对大型服务器系统，移动设备和消费者设备等其他计算领域的潜在更广泛的适用性；尤其是在未来，精细颗粒能源会计将是所有计算设备不可或缺的一部分。除了对技术的影响之外，该项目还将通过对参与该项目的学生的教育利益来为劳动力发展做出贡献，该项目将以类似于小型企业的结构进行组织，并鼓励在短时间内找到创新的解决方案，并每周与企业导师会面。