GOALI: Size and Anisotropy Effects in Micro/Nano-bonds with Comparable Grain and Bond Sizes

目标：具有可比晶粒和键尺寸的微/纳米键的尺寸和各向异性效应

• 批准号: 1416682
• 负责人: Leila Ladani
• 金额: $ 19.76万
• 依托单位: University of Connecticut
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-08-22 至 2017-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1416682&HistoricalAwards=false
• 关键词: GOALI; Size; Anisotropy; Effects; Micro

This Grant Opportunities for Academic Liaison with Industry (GOALI) award is to investigate process-microstructure-mechanical behavior in micro/nano bonds fabricated using a new technology of solid-liquid inter-diffusion. These bonds, that are used to join metallic interconnects in microelectronic devices, have a comparable size with their constituting grains. Therefore, they are expected to behave anisotropically. Furthermore, unlike conventional joints, these joints mainly consist of intermetallics which profoundly affect the mechanical behavior of these bonds. Mechanical reliability of these bonds dictates the reliability and yield of the electronic devices fabricated using these bonds. The goal of this research is to investigate the kinetics of bond formation as well as the mechanics of deformation, fatigue and failure of these bonds through modeling and experimentation. An experiment will be designed and conducted on the process to determine the effect of process parameters on the microstructure and mechanical behavior of these bonds and to determine the optimal process condition. Phase field numerical models will be developed to simulate the kinetics of bond formation. Mechanisms of deformation and damage will be studied through in situ mechanical and fatigue experiments at the micro/nano scale. Finite element simulation will be used to model fatigue and damage in these anisotropic bonds. The research will be conducted in collaboration with Intel Corporation who will provide assistance with specimen fabrication, thermo-mechanical fatigue testing and failure analysis of the specimens. This research will lead to enhancements in the solid-liquid inter-diffusion process making it a viable option for electronic manufacturers to produce energy efficient high quality and reliable electronic devices. It will facilitate and expedite the process of eliminating lead from the current electronic processes making the process more environmentally friendly and benign. Simulation tools and fundamental knowledge generated in this research will advance several disciplines including electronic manufacturing, mechanics and material science and engineering.

该学术联络的赠款机会（Goali）奖是在使用固体液间间扩散的新技术制造的微型/纳米债券中研究过程微观机械行为。这些键用于在微电器设备中连接金属互连的键，其构成晶粒具有相当的尺寸。因此，预计他们将以各向异性行为。此外，与常规关节不同，这些关节主要由金属层组成，这些金属会深刻影响这些键的机械行为。这些债券的机械可靠性决定了使用这些键制造的电子设备的可靠性和产量。这项研究的目的是通过建模和实验来研究键形成的动力学以及这些键的变形，疲劳和失败的力学。将在过程中设计和进行实验，以确定过程参数对这些键的微结构和机械行为的影响并确定最佳过程条件。将开发相位场数模型以模拟键形成的动力学。变形和损伤的机制将通过微/纳米尺度的原位机械和疲劳实验研究。有限元模拟将用于模拟这些各向异性键中的疲劳和损害。这项研究将与英特尔公司合作进行，该公司将在标本制造，机电疲劳测试和标本的失败分析方面提供帮助。 这项研究将导致固定液体间扩散过程的增强，这使其成为电子制造商生产能节能高质量和可靠的电子设备的可行选择。 它将促进并加快从当前的电子过程中消除铅的过程，从而使过程更加环保和良性。这项研究中产生的仿真工具和基本知识将推进几个学科，包括电子制造，力学和材料科学与工程。