SBIR Phase I: PowERazor: an Innovative Electronic Packaging Technology for Manufacturing High-reliability, High-density Power Electronics Modules

SBIR 第一阶段：PowERazor：用于制造高可靠性、高密度电力电子模块的创新电子封装技术

• 批准号: 1315429
• 负责人: David Berry
• 金额: $ 15万
• 依托单位: NBE Technologies, LLC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-07-01 至 2013-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1315429&HistoricalAwards=false
• 关键词: SBIR; Phase; PowERazor; Innovative; Electronic; SBIR; Phase; PowERazor; Innovative; Electronic

This Small Business Innovative Research (SBIR) Phase I project is aimed at demonstrating the feasibility of an electronic packaging technology for manufacturing power electronics modules that are critical for electrical energy processing in a wide range of systems, such as hybrid or electric vehicles, renewable energy generators, and the power grid. Recent advances in power semiconductor devices and substrate technology require packaging schemes which optimize the performance of each component for further increases in reliability, density, and high-temperature performance. The best route for meeting this need is to explore three dimensional package architectures which have previously been a barrier for manufacturing using solder techniques. This project will build on the commercialization success of a nanomaterial technology for device interconnection, to develop and implement an innovative three dimensional package architecture which can be force cooled equally well from both sides. The nanomaterial, which already boasts significant increases in thermal and electrical conductivity, is known to provide high reliability and high temperature joints for device interconnection. In addition, processing requirements can be tailored to significantly simplify fabrication of architectures which are difficult to create using existing solder and epoxy connection schemes. Utilizing the processing benefits of the nanomaterial die attachment, the specific technical objectives are: (1) development of a manufacturable process with the nanomaterial for fabricating the planar power modules; (2) testing of the modules under applied continuous current; and (3) evaluation of the module reliability under temperature/power cycling tests and (4) characterization of failure mechanisms. The double-side cooled planar power module technology enabled by the nanomaterial would lead to a highly competitive product in the market place.The broader impact/commercial potential of this project would strengthen United States? manufacturing base in the field of power electronics. Power electronics modules are the central processing units for electrical energy conversion and are crucial to the nation?s economy and security. Energy applications, specifically those that provide independence from petroleum, require more efficient conversion of electrical power, and demand for reliability and sustainability of the nation?s power infrastructure requires an increasingly greater number of electrical conversions. Currently, the market of power electronics modules is dominated by products made in Europe and Asia. Successful commercialization of the technology developed in this project would usher in a competitive US manufacturer of power modules to the growing power electronics market. The success would further strengthen commercialization effort of the nanomaterial product developed under a NSF STTR program and directly translate to economic growth for Southwest Virginia. Success of this program would also serve as a good educational and business model for transferring fundamental knowledge developed under NSF?s support into the commercial world. It would present students an ideal case study to experience technological and economical impacts of their research activities.

这项小型企业创新研究（SBIR）I阶段项目旨在证明电子包装技术用于制造电源电子模块的可行性，这些模块对于在各种系统（例如混合或电动汽车，可再生能源生成器）等多种系统中至关重要。 功率半导体设备和底物技术的最新进展需要包装方案，以优化每个组件的性能，以进一步提高可靠性，密度和高温性能。 满足这种需求的最佳途径是探索三维软件包架构，这些架构以前是使用焊料技术制造的障碍。 该项目将基于用于设备互连的纳米材料技术的商业化成功，以开发和实施创新的三维软件包体系结构，从双方也可以很好地冷却。已知纳米材料已经具有热量和电导率的显着增加，可为设备互连提供高可靠性和高温接头。 此外，可以对处理要求进行量身定制，以显着简化建筑的制造，这些架构很难使用现有的焊料和环氧连接方案来创建。利用纳米材料模具依恋的加工益处，具体的技术目标是：（1）使用纳米材料制造平面功率模块的可制造过程； （2）测试在应用连续电流下的模块； （3）在温度/功率循环测试和（4）故障机制表征下的模块可靠性评估。 由纳米材料实现的双面冷却平面功率模块技术将导致市场上竞争激烈的产品。该项目的更广泛的影响/商业潜力会增强美国吗？电力电子领域的制造基地。电力电子模块是电能转换的中央处理单元，对国家的经济和安全至关重要。能源应用，特别是那些脱离石油的人，需要对电力进行更有效的转换，以及对国家电力基础设施的可靠性和可持续性的需求，需要越来越多的电气转换。 目前，电力电子模块的市场主要由欧洲和亚洲生产的产品主导。该项目开发的技术的成功商业化将使美国电力模块的竞争力制造商推向不断增长的电力电子市场。 成功将进一步加强根据NSF STTR计划开发的纳米材料产品的商业化工作，并直接转化为西南弗吉尼亚州的经济增长。该计划的成功还将成为一种良好的教育和商业模式，用于将基本知识转移到商业世界中。它将为学生提供理想的案例研究，以体验其研究活动的技术和经济影响。