SHF:Medium:Collaborative Research: Electrical-thermal Co-Design of Microfluidically-Cooled 3D IC's

SHF：Medium：协作研究：微流控 3D IC 的电热协同设计

• 批准号: 1302297
• 负责人: Muhannad Bakir
• 金额: $ 46万
• 依托单位: Georgia Tech Research Corporation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-09-15 至 2019-02-28
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1302297&HistoricalAwards=false
• 关键词: SHF; Medium; Collaborative; Research; Electrical

The technical goal of this project is to develop and refine the micro-fluidic 3D IC cooling technology. While 3D integration offers significant potential for improving the performance, energy efficiency and functionality of electronic systems, the problem of heat removal is significantly exacerbated. Conventional air cooling alone would be incapable of addressing the future 3D IC heat removal requirements. In this project, the PIs are investigating use of aggressive micro-fluidic cooling technology for cooling 3D ICs. The team comprises researchers from University of Maryland and Georgia Institute of Technology. The Georgia Tech team would bring forth significant expertise in fabrication and modeling of 3D ICs with interlayer micro-fluidic cooling. The Maryland team will bring forth expertise in VLSI design methodologies. The primary focus of this proposal is: development of techniques and tools for co-design of micro-fluidic embedded cooling and electrical aspects of 3D ICs.This proposal would directly support several PhD students in different disciplines. Because of the cross disciplinary nature of this proposal, these students would need to learn diverse set of topics pertaining to fluidics, chip design and thermal management. Undergraduates will also be involved through various programs at Georgia Tech and Maryland. The outcomes of this research will be published in respectable venues in both electrical/computer engineering and mechanical engineering. The tools, models and experimental data will also be made available on the web. The PIs plan to organize tutorials at various conferences and educational forums. Special emphasis will be givenon minority involvement via collaboration with local HBCUs.

该项目的技术目标是开发和完善微流控3D IC冷却技术。虽然 3D 集成为提高电子系统的性能、能源效率和功能提供了巨大潜力，但散热问题却显着加剧。仅靠传统空气冷却无法满足未来 3D IC 的散热要求。在该项目中，PI 正在研究使用激进的微流体冷却技术来冷却 3D IC。该团队由来自马里兰大学和佐治亚理工学院的研究人员组成。佐治亚理工学院团队将在具有层间微流体冷却的 3D IC 制造和建模方面提供重要的专业知识。马里兰州团队将带来 VLSI 设计方法方面的专业知识。该提案的主要重点是：开发用于微流体嵌入式冷却和 3D IC 电气方面协同设计的技术和工具。该提案将直接支持不同学科的几名博士生。由于该提案的跨学科性质，这些学生需要学习与流体学、芯片设计和热管理相关的各种主题。本科生还将参与佐治亚理工学院和马里兰州的各种项目。这项研究的成果将在电气/计算机工程和机械工程领域的知名场所发表。工具、模型和实验数据也将在网络上提供。 PI 计划在各种会议和教育论坛上组织教程。将特别强调通过与当地 HBCU 合作少数群体的参与。