SHF:Medium:Collaborative Research: Electrical-thermal Co-Design of Microfluidically-Cooled 3D IC's

SHF：Medium：协作研究：微流控 3D IC 的电热协同设计

• 批准号: 1302297
• 负责人: Muhannad Bakir
• 金额: $ 46万
• 依托单位: Georgia Tech Research Corporation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-09-15 至 2019-02-28
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1302297&HistoricalAwards=false
• 关键词: SHF; Medium; Collaborative; Research; Electrical

The technical goal of this project is to develop and refine the micro-fluidic 3D IC cooling technology. While 3D integration offers significant potential for improving the performance, energy efficiency and functionality of electronic systems, the problem of heat removal is significantly exacerbated. Conventional air cooling alone would be incapable of addressing the future 3D IC heat removal requirements. In this project, the PIs are investigating use of aggressive micro-fluidic cooling technology for cooling 3D ICs. The team comprises researchers from University of Maryland and Georgia Institute of Technology. The Georgia Tech team would bring forth significant expertise in fabrication and modeling of 3D ICs with interlayer micro-fluidic cooling. The Maryland team will bring forth expertise in VLSI design methodologies. The primary focus of this proposal is: development of techniques and tools for co-design of micro-fluidic embedded cooling and electrical aspects of 3D ICs.This proposal would directly support several PhD students in different disciplines. Because of the cross disciplinary nature of this proposal, these students would need to learn diverse set of topics pertaining to fluidics, chip design and thermal management. Undergraduates will also be involved through various programs at Georgia Tech and Maryland. The outcomes of this research will be published in respectable venues in both electrical/computer engineering and mechanical engineering. The tools, models and experimental data will also be made available on the web. The PIs plan to organize tutorials at various conferences and educational forums. Special emphasis will be givenon minority involvement via collaboration with local HBCUs.

该项目的技术目标是开发和完善微富集3D IC冷却技术。虽然3D集成为提高电子系统的性能，能源效率和功能提供了重要潜力，但去除热量的问题显着加剧。仅常规的空气冷却将无法解决未来的3D IC去除量的要求。在该项目中，PI正在调查使用侵略性微富集冷却技术进行冷却3D IC的使用。该团队由马里兰大学和佐治亚理工学院的研究人员组成。佐治亚理工学队将通过层间微富集冷却来实现3D IC的制造和建模方面的重要专业知识。马里兰州团队将提出VLSI设计方法的专业知识。该提案的主要重点是：开发技术和工具，用于共同设计3D IC的微富集嵌入式冷却和电气方面。该提案将直接支持不同学科中的几位博士学位学生。由于该提案的跨学科性质，这些学生需要学习与流体，芯片设计和热管理有关的各种主题。佐治亚理工学院和马里兰州的各种计划也将参与本科生。这项研究的结果将在电气/计算机工程和机械工程的受人尊敬的场所发表。工具，模型和实验数据也将在网络上提供。 PIS计划在各种会议和教育论坛上组织教程。通过与当地HBCUS的合作，特别重点将是纪念少数派的参与。