CAREER: Process, Voltage, and Temperature (PVT)-Tolerant CMOS Photonic Interconnect Transceiver Architectures

职业:耐工艺、电压和温度 (PVT) 的 CMOS 光子互连收发器架构

基本信息

项目摘要

Intellectual Merit: The photonic interconnect architectures and design techniques proposed here aim to significantly improve interconnect robustness, energy efficiency, and bandwidth density, which is necessary for continued scaling of future computer systems. While progress has been made in photonic interconnects, the optimal interconnect architecture which most efficiently leverages these optical devices for off-chip and network-on-chip applications is still an open question. This work?s research goal is to develop robust energy-efficient transceivers for a unified inter- and intra-chip photonic interconnect architecture based on integrated ring resonator modulators and waveguide photodetectors. To accomplish this goal, an ultra-fast system-level optimization framework for photonic on-chip networks and inter-chip links that investigates trade-offs in bandwidth density, energy efficiency, and interconnect throughput will be developed to compare photonic interconnect technologies and leveraged in the design of the proposed architecture. Novel circuit topologies will be developed that address challenges imposed due to nanometer transistor scaling properties, such as transistor reliability constraints conflicting with voltage-swing requirements of optical source devices and shrinking transistor gain and growing mismatch having a large impact on receiver sensitivity. The combination of system level optimization with circuit-level accuracy and new ultra-efficient circuit topologies enables architectures capable of leveraging photonic interconnects? properties of extreme low latency and high bandwidth to realize completely new computing models with orders of magnitude performance improvement.Broader Impact: The explosion in interconnect bandwidth capacity provided by this photonic interconnect architecture will allow the realization of numerous transformative applications, such as future smart mobile devices capable of Tflop/s performance, multi-channel high-resolution magnetic resonance imaging, and exascale supercomputers. Interconnect architectures developed with the proposed optimization framework will have a broad impact on not only the US semiconductor industry, but also on the sustainability and security of the nation as a whole, as it will dramatically reduce the energy these integrated systems demand. This project will include an interdisciplinary educational program involving 1 Ph.D. and 5 undergraduate students, with a commitment in several engaging outreach activities to foster the representation of women and minority groups. These activities include participating in a four-week summer workshop for K-12 school teachers and also annual one-week summer camps for high school students. Project results will be broadly disseminated by inclusion in the syllabi and website of a new graduate course entitled ?Optical Interconnect Circuits and Systems? and through publication in national and international journals and conferences.
智力优点:这里提出的光子互连体系结构和设计技术旨在显着提高互连的鲁棒性,能源效率和带宽密度,这对于未来计算机系统的持续扩展是必不可少的。尽管在光子互连中取得了进展,但最有效地利用这些光学设备的最佳互连体系结构仍是芯片和芯片上的网络应用程序,仍然是一个空旷的问题。这项工作的研究目标是为基于集成的环谐振器调制器和波导光电视统一的统一间和芯片光子互连体系结构开发可强大的节能收发器。为了实现这一目标,将开发用于调查带宽密度,能量效率和互连吞吐量的取舍的超快速系统级优化框架和片间链接,以比较光光子互连技术和利用。在拟议的建筑的设计中。将开发出新的电路拓扑结构,以解决由于纳米晶体管缩放特性所引起的挑战,例如晶体管可靠性约束与光源设备的电压冲压要求相冲突,并缩小晶体管增益和不匹配的不匹配对接收方敏感性产生了很大的影响。系统级优化与电路级的精度和新的超高电路拓扑的结合使能够利用光子互连的体系结构?极端低潜伏期和高带宽的属性,以实现具有数量级绩效改进的全新计算模型。Boader的影响:这种光子互连体系结构提供的互连带宽容量的爆炸将允许实现众多变革性应用,例如未来的智能移动具有TFLOP/S性能,多通道高分辨率磁共振成像和Exascale超级计算机的设备。通过拟议的优化框架开发的互连体系结构将不仅对美国半导体行业产生广泛的影响,而且还将对整个国家的可持续性和安全性产生广泛的影响,因为它将大大减少这些集成系统需求的能量。该项目将包括一个涉及1博士学位的跨学科教育计划。和5名本科生,在几项参与的外展活动中做出了承诺,以促进妇女和少数群体的代表。这些活动包括参加为K-12学校老师举办的为期四周的夏季研讨会,以及每年为高中生的一周夏令营。项目结果将通过包含在课程和网站上的新研究生课程的网站上广泛传播,标题为“光学互连电路和系统?并通过在国家和国际期刊和会议上发表。

项目成果

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Samuel Palermo其他文献

Samuel Palermo的其他文献

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{{ truncateString('Samuel Palermo', 18)}}的其他基金

ACED Fab: Co-Design of Novel Electronic-Photonic Systems for Energy-Efficient Coherent Optical Interconnects
ACED Fab:用于节能相干光互连的新型电子-光子系统的协同设计
  • 批准号:
    2314868
  • 财政年份:
    2023
  • 资助金额:
    $ 40万
  • 项目类别:
    Standard Grant
EARS: A Wideband Frequency-Agile Silicon Photonic mm-Wave Receiver with Automatic Jammer Suppression via Rapidly Reconfigurable Optical Notch Filters
EARS:宽带频率捷变硅光子毫米波接收器,通过快速可重构光学陷波滤波器实现自动干扰抑制
  • 批准号:
    1547432
  • 财政年份:
    2015
  • 资助金额:
    $ 40万
  • 项目类别:
    Standard Grant
Advanced Modeling and Design of High-Performance ADC-Based Serial Links
基于高性能 ADC 串行链路的高级建模和设计
  • 批准号:
    1202508
  • 财政年份:
    2012
  • 资助金额:
    $ 40万
  • 项目类别:
    Standard Grant

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