MRI-R2: Acquisition of Precision Wafer Aligner / Bonder for 3-D Integrated Nano-Opto-Electromechanical Systems (NOEMS).

MRI-R2：采购用于 3D 集成纳米光机电系统 (NOEMS) 的精密晶圆对准器/接合器。

• 批准号: 0959935
• 负责人: Zeynep Celik-Butler
• 金额: $ 53.5万
• 依托单位: University of Texas at Arlington
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2010
• 资助国家: 美国
• 起止时间: 2010-05-01 至 2012-04-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0959935&HistoricalAwards=false
• 关键词: MRI; R2; Acquisition; Precision; Wafer

"This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5)"The objective of this research is integration of optical, electrical and mechanical systems at nano- and micro-meter scale, thus enabling novel biomedical, energy harvesting and structural health monitoring devices and systems, otherwise not possible. The approach is to use a wafer aligner and bonder system for precision alignment and bonding of a diverse set of substrates including semiconductor wafers, glass substrates, metals and polymers.The intellectual merit lies in combining top-down and bottom-up fabrication techniques to pioneer new interfaces between semiconductor-based devices and biomolecules that can be tailored for specific applications, both as sensors and actuators / controllers of biological phenomena. The interrogation of bio-molecules and understanding of real cellular interactions require 3-D biocompatible structures, chambers and interfaces. Ranging in length scales from a few nanometers to many microns, inter and intra-cellular mechano-transduction signals play important roles in many aspects of cellular functions.The proposed Precision Wafer Aligner / Bonder will be part of NanoFab at UT Arlington, which is an interdisciplinary resource open to scientists within and outside of the University. The Dallas-Forth Worth metropolitan region is home to more than 400 high tech institutions. As a user facility, the NanoFab will make the wafer aligner / bonder available 24/7 to these researchers and provide them training for usage. An annual workshop as well as an online discussion forum dedicated to 3-D integration will be established.

“该奖项是根据2009年的《美国回收与再投资法》（公法111-5）资助的。这项研究的目的是将光学，电气和机械系统的整合在纳米和微米量表上的整合，从而实现了新型的生物医学，能源收集，结构性健康监测设备和系统，否则就无法实现。这种方法是使用晶圆对准器和螺旋系统来精确对齐和键合各种底物，包括半导体的瓦金，玻璃底物，金属和聚合物。智力优点在于将自上而下的和自下而上的制造技术结合到基于半导体的设备之间的特定设备和自下而上的互动技术，以范围内的设备和范围内的特定范围。 /生物学现象的控制器。对生物分子的询问和对真实细胞相互作用的理解需要3-D生物相容性结构，腔室和界面。从几纳米到许多微米，间和细胞内机械截止信号的长度尺度范围在蜂窝功能的许多方面都起着重要作用。建议的精确精度晶圆晶片对准器 / Bonder将是UT Arlington的Nanofab的一部分，这是对大学内外的科学家开放的跨学科资源。达拉斯·菲斯（Dallas-Forth）的大都市地区是400多家高科技机构的所在地。作为用户设施，纳米型刀将使这些研究人员24/7全天候可提供晶圆对准器 /邦德，并为他们提供使用培训。将建立一个专门针对3D集成的年度研讨会以及在线讨论论坛。