GOALI - Particle Adhesion in Semiconductor Wafer Cleaning

GOALI - 半导体晶圆清洗中的颗粒粘附

• 批准号: 0829086
• 负责人: Stephen Beaudoin
• 金额: $ 30万
• 依托单位: Purdue University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2008
• 资助国家: 美国
• 起止时间: 2008-09-01 至 2011-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0829086&HistoricalAwards=false
• 关键词: GOALI; Particle; Adhesion; Semiconductor; Wafer

CBET-0829086BeaudoinThis proposed research is a combined theoretical and experimental study of the adhesion of micro- and nano-scale particles to nano-structured wafers of interest to the microelectronics community. At present the microelectronics industry has no manufacturable technologies for cleaning future wafers. In particular, the patterns of interest on the wafers are too fragile to be subjected to existing cleaning approaches. The development of new cleaning technologies requires understanding of the contaminant adhesion forces, but the length scales of the patterns on the wafers are rapidly approaching the length scales of the basic forces that control the particle adhesion. This work will measure and model this adhesion. The Intellectual Merit of the proposed work lies in the new theoretical and experimental methods to be employed to categorize the adhesion of micro- and nano-scale particles to rough nano-patterned or nano-layered surfaces. New theoretical descriptions of the effects of finite, patterned surfaces on the van der Waals and electrostatic adhesion forces between the surfaces will be developed and validated experimentally. Provisions within the research have been made to measure and model capillary forces, should they arise. Colloidal probe microscopy will be performed to allow adhesion forces between the substrates and the particles to be measured directly. The use of focused ion beam/scanning electron microscopy (FIB/SEM) or scanning transmission electron microscopy/energy-filtered transmission electron microscopy (STEM/EFTEM) to create 3D maps of particle geometry and morphology with nano-scale precision will allow creation of detailed models of the particle surfaces. These will be used in force models that predict the observed adhesion. Such models will be the first of their kind. The Broader Impacts of this work are articulated in several fashions. First, the technical results of the work are of profound importance to the microelectonics industry, as the industry currently possesses no manufacturable approaches for cleaning future wafers and photomasks. Particle adhesion is also critically important to the pharmaceutical industry where particle flows and particle mixing are essential processes, and in homeland security matters, where sampling and sensing of nano- and micro-particles of explosives, biological agents, or radioactive agents is necessary. The proposed work will also be part of an outreach effort to a local elementary school that will involve over 120 second graders and 6 teachers each year. The students and teachers will travel to Purdue in small groups and will use the AFM to make topographical maps of leaves, grass, CDs, DVDs, fingernails, hair and skin. They will take the images they collect and use them to reinforce the content they are learning in the classroom using lessons jointly developed by Beaudoin and the teaching staff. The industry partner in this work, FSI International (FSI), will provide wafers, particle deposition capability, wafer cleaning capability, and metrology for evaluating wafer cleaning effectiveness. Beaudoin will perform particle adhesion and modeling studies on the wafers provided by FSI, and will feed the results of these studies back to FSI. FSI, in turn, will use these results to optimize the operation of its cryogenic aerosol-based wafer cleaner, and will document the accuracy of Beaudoin's adhesion models. FSI also will host Beaudoin's student for one month each summer to perform experiments in an industrial setting at FSI.

CBET-0829086Beaudoin 这项研究是对微电子界感兴趣的微米级和纳米级颗粒粘附到纳米结构晶圆上的理论和实验相结合的研究。目前微电子行业还没有用于清洁未来晶圆的可制造技术。特别是，晶片上的目标图案太脆弱，无法采用现有的清洁方法。新清洁技术的开发需要了解污染物粘附力，但晶圆上图案的长度尺度正在迅速接近控制颗粒粘附力的基本力的长度尺度。这项工作将测量和模拟这种粘附力。该工作的智力价值在于采用新的理论和实验方法来对微米级和纳米级颗粒对粗糙纳米图案或纳米分层表面的粘附进行分类。将开发并通过实验验证有限图案表面对范德华力和表面之间静电粘附力影响的新理论描述。研究中已经制定了测量和模拟毛细管力（如果出现）的规定。将进行胶体探针显微镜检查以直接测量基底和颗粒之间的粘附力。使用聚焦离子束/扫描电子显微镜 (FIB/SEM) 或扫描透射电子显微镜/能量过滤透射电子显微镜 (STEM/EFTEM) 以纳米级精度创建颗粒几何形状和形态的 3D 图，将允许创建颗粒表面的详细模型。这些将用于预测观察到的粘附力的力模型。此类模型将是此类模型中的第一个。这项工作的更广泛影响以多种方式阐述。首先，这项工作的技术成果对微电子行业具有深远的重要性，因为该行业目前没有可制造的方法来清洁未来的晶圆和光掩模。颗粒粘附对于制药行业也至关重要，在制药行业中，颗粒流动和颗粒混合是必不可少的过程；在国土安全事务中，需要对爆炸物、生物制剂或放射性制剂的纳米和微米颗粒进行采样和传感。拟议的工作也将成为当地一所小学外展工作的一部分，该小学每年将涉及 120 多名二年级学生和 6 名教师。学生和老师将以小组形式前往普渡大学，并使用 AFM 制作树叶、草、CD、DVD、指甲、头发和皮肤的地形图。他们将拍摄收集到的图像，并利用博杜安和教学人员共同开发的课程来强化他们在课堂上学习的内容。 这项工作的行业合作伙伴 FSI International (FSI) 将提供晶圆、颗粒沉积能力、晶圆清洁能力以及用于评估晶圆清洁效果的计量技术。 Beaudoin 将在 FSI 提供的晶圆上进行颗粒粘附和建模研究，并将这些研究结果反馈给 FSI。反过来，FSI 将利用这些结果来优化其基于低温气溶胶的晶圆清洁器的操作，并将记录 Beaudoin 粘附模型的准确性。 FSI 每年夏天还将接待 Beaudoin 的学生一个月，让他们在 FSI 的工业环境中进行实验。