GOALI: Investigating Metrology Issues in Chemical Mechanical Planarization Process for Microelectronics Manufacturing

GOALI：研究微电子制造化学机械平坦化工艺中的计量问题

• 批准号: 0218141
• 负责人: Ashok Kumar
• 金额: --
• 依托单位: University of South Florida
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2002
• 资助国家: 美国
• 起止时间: 2002-09-01 至 2007-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0218141&HistoricalAwards=false
• 关键词: GOALI; Investigating; Metrology; Issues; Chemical

The objective of the proposed activities under the Grant Opportunities for Academic Liaison with Industry (GOALI) with Agere Systems Inc. is to develop a strong well-integrated research and education program focused on the understanding of the mechanical and tribological properties of chemical mechanical planarization (CMP) processes for semiconductor manufacturing applications. Integration of low-k materials in the metallization structures creates severe problems during process integration. One of the major challenges in the process integration after the incorporation of low-k materials is CMP of these films due to the reduced modulus and cohesive strength. Due to the emergence of CMP as the method of choice for global planarization of dielectric and metal films, the frictional forces generated during the CMP process have assumed significant importance. Understanding the mechanical and tribological properties of complex stacks involving low-k dielectrics is critical for successful evaluation and implementation of these materials and the main goals of the proposed research are to obtain the fundamental understanding of the nature of surface planarization and identify the mechanism to control the CMP process. As part of this GOALI proposal, Agere Systems Inc. will support as in-kind services like: a) provide CMP consumables (wafer, slurry, and pad) to perform the CMP experiments, b) provide engineer/scientist from the industry to serve as a thesis/dissertation advisor, b) provide resident workspace for a graduate student together with all on-site cost of materials and supplies to support the research, c) assign one engineer/scientist (approximately 10 % of their time to work and monitor the progress of the research), e) to emphasize technology transfer and implementation of research findings in manufacturing. This GOALI proposal aims to synergize the Agere-USF partnership by providing opportunities for faculty, postdoctoral fellows and students to conduct research and gain experience with production processes in an industrial setting. The university-industry collaboration will provide additional opportunity for students to work with industrial scientists and use of their additional state-of-the-art equipment facilities. Apart from providing hands-on experience, the proposed research will provide a unique opportunity for the students to be involved in interdisciplinary research- a must for future success. Results of the project will be disseminated by paper presentation in regional and national conferences, and published in appropriate scientific journals

杰尔系统公司与工业界学术联络资助机会 (GOALI) 下拟议活动的目标是开发一个强大的、综合性的研究和教育计划，重点是了解化学机械平面化的机械和摩擦学特性（用于半导体制造应用的 CMP）工艺。金属化结构中低k材料的集成在工艺集成过程中产生了严重的问题。结合低 k 材料后工艺集成的主要挑战之一是由于模量和内聚强度降低而对这些薄膜进行 CMP。由于 CMP 成为电介质和金属薄膜整体平坦化的首选方法，因此 CMP 过程中产生的摩擦力变得非常重要。了解涉及低 k 电介质的复杂叠层的机械和摩擦学特性对于成功评估和实施这些材料至关重要，本研究的主要目标是获得对表面平坦化性质的基本了解并确定控制机制CMP 工艺。 作为 GOALI 提案的一部分，杰尔系统公司将提供实物服务支持，例如：a) 提供 CMP 耗材（晶圆、浆料和抛光垫）来执行 CMP 实验，b) 提供业界工程师/科学家来服务作为论文顾问，b) 为研究生提供常驻工作空间以及支持研究的所有现场材料和用品成本，c) 指派一名工程师/科学家（大约 10 名） ％的时间用于工作和监控研究进展），e）强调技术转让和研究成果在制造中的实施。该 GOALI 提案旨在通过为教师、博士后研究员和学生提供在工业环境中进行研究并获得生产流程经验的机会，来协同杰尔与南佛罗里达大学的合作伙伴关系。大学与工业界的合作将为学生提供与工业科学家合作并使用他们最先进的设备设施的额外机会。除了提供实践经验外，拟议的研究还将为学生提供参与跨学科研究的独特机会——这是未来成功的必要条件。该项目的结果将通过在区域和国家会议上发表论文的方式传播，并在适当的科学期刊上发表