CAREER: Novel Environmentally-Benign Solders for Electronic Packaging: Thermomechanical Behavior and Characterization
职业:用于电子封装的新型环保焊料:热机械行为和表征
基本信息
- 批准号:0092530
- 负责人:
- 金额:--
- 依托单位:
- 依托单位国家:美国
- 项目类别:Continuing Grant
- 财政年份:2001
- 资助国家:美国
- 起止时间:2001-02-01 至 2008-01-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
0092530Chawla This CAREER program examines novel, environmentally benign solders in bulk form and at small length scales. The research plan includes experimental investigations coupled with computational modeling of the mechanical behavior and microstructure of promising Pb-Sn solder replacement alloys (Sn-Cu, Sn-Ag, and Sn-Ag-Cu). The role of evolution of microstructure, including coarsening of the solder microstructure and solder/substrate interactions, is examined with respect to the creep and thermal fatigue behavior. The evolution of microstructure is modeled using the novel, microstructure-integrated, Object Oriented Finite Element Method (OOF), recently developed at the National Institute for Standards and Technology (NIST). Novel micromechanical testing techniques will be developed to characterize thermomechanical behavior at the solder ball level. Conventional FEM techniques, using accurately measured constitutive behavior derived from micromechanical testing, will be used to develop life prediction methodologies. In addition, an outreach program will be implemented through the Office for Minority Engineering Students (OMEP) and the Women in Science and Engineering (WISE) program at Arizona State University. High school teachers will spend a summer in the PI's laboratory to gain experience with cutting edge research. Also, part-time students from industry will take part in new and revised courses dealing with the subject of materials for electronic packaging, including physical and mechanical metallurgy of solders. %%%Given the widespread use of Pb-Sn solder in the manufacture and assembly of circuit boards, the development and reliability of new Pb-free solders is crucial for the successful substitution of these materials in the electronic systems. The subject of Pb-free solders is of great interest to local companies such as Intel, Motorola, and Onsemiconductor and close interaction with industry is expected throughout the course of this career development program. It is believed that the education outreach effort will contribute to an increase in the number of undergraduate students majoring in materials science. This is particularly important given the high demand for engineers with materials backgrounds in the microelectronic packaging industry. ***
0092530Chawla 该职业计划以散装形式和小长度尺寸检验新颖、环保的焊料。该研究计划包括实验研究以及有前途的 Pb-Sn 焊料替代合金(Sn-Cu、Sn-Ag 和 Sn-Ag-Cu)的机械行为和微观结构的计算建模。微观结构演变的作用,包括焊料微观结构的粗化和焊料/基材相互作用,在蠕变和热疲劳行为方面进行了研究。微观结构的演变是使用美国国家标准与技术研究所 (NIST) 最近开发的新颖的、微观结构集成的面向对象有限元方法 (OOF) 进行建模的。 将开发新型微机械测试技术来表征焊球级别的热机械行为。传统的有限元技术利用微机械测试中精确测量的本构行为,将用于开发寿命预测方法。 此外,还将通过亚利桑那州立大学少数族裔工程学生办公室 (OMEP) 和科学与工程女性 (WISE) 计划实施一项外展计划。 高中教师将在 PI 的实验室度过一个夏天,以获得前沿研究的经验。 此外,来自工业界的兼职学生将参加涉及电子封装材料主题的新课程和修订课程,包括焊料的物理和机械冶金学。 %%%鉴于铅-锡焊料在电路板的制造和组装中的广泛使用,新型无铅焊料的开发和可靠性对于在电子系统中成功替代这些材料至关重要。无铅焊料主题引起了英特尔、摩托罗拉和安森美半导体等当地公司的极大兴趣,并且期望在整个职业发展计划的整个过程中与行业进行密切互动。相信教育推广工作将有助于增加材料科学专业本科生的数量。考虑到微电子封装行业对具有材料背景的工程师的高需求,这一点尤为重要。 ***
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Nikhilesh Chawla其他文献
Bismuth pyramid formation during solidification of eutectic tin-bismuth alloy using 4D X-ray microtomography
使用 4D X 射线显微断层扫描技术研究共晶锡铋合金凝固过程中铋金字塔的形成
- DOI:
10.1038/s43246-024-00538-9 - 发表时间:
2024-06-06 - 期刊:
- 影响因子:7.8
- 作者:
Amey Luktuke;Alan L. Kastengren;Viktor Nikitin;Hamidreza Torbati;Nikhilesh Chawla - 通讯作者:
Nikhilesh Chawla
Unveiling the deformation behavior and strengthening mechanisms of Al3BC/Al composites via in-situ micropillar compression
通过原位微柱压缩揭示 Al3BC/Al 复合材料的变形行为和强化机制
- DOI:
10.1016/j.jallcom.2020.153842 - 发表时间:
2020 - 期刊:
- 影响因子:6.2
- 作者:
Yongfeng Zhao;Arun Sundar S.Singaravelu;Xia Ma;Qingdong Zhang;Shery L.Y.Chang;Xiangfa Liu;Nikhilesh Chawla - 通讯作者:
Nikhilesh Chawla
Micromechanical properties and deformation behavior of Al3BC/6061 Al composites via micropillar compression
Al3BC/6061 Al 复合材料微柱压缩的微观力学性能和变形行为
- DOI:
10.1016/j.msea.2019.138852 - 发表时间:
2020 - 期刊:
- 影响因子:0
- 作者:
Yongfeng Zhao;Arun Sundar S.Singaravelu;Xia Ma;Qingdong Zhang;Xiangfa Liu;Nikhilesh Chawla - 通讯作者:
Nikhilesh Chawla
Mechanical properties of Al3BC by nanoindentation and micropillar compression
通过纳米压痕和微柱压缩测定 Al3BC 的机械性能
- DOI:
10.1016/j.matlet.2020.127361 - 发表时间:
2020 - 期刊:
- 影响因子:3
- 作者:
Yongfeng Zhao;Arun Sundar S.Singaravelu;Xia Ma;Xiangfa Liu;Nikhilesh Chawla - 通讯作者:
Nikhilesh Chawla
Fatigue crack initiation and propagation of binder-treated powder metallurgy steels
粘合剂处理粉末冶金钢的疲劳裂纹萌生和扩展
- DOI:
10.1007/s11661-002-0006-8 - 发表时间:
2024-09-13 - 期刊:
- 影响因子:0
- 作者:
S. Polasik;Jason J. Williams;Nikhilesh Chawla - 通讯作者:
Nikhilesh Chawla
Nikhilesh Chawla的其他文献
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{{ truncateString('Nikhilesh Chawla', 18)}}的其他基金
Collaborative Research: Solid-State Additive Manufacturing of Metal Matrix Composites via Cold Spray
合作研究:通过冷喷涂进行金属基复合材料的固态增材制造
- 批准号:
2330318 - 财政年份:2024
- 资助金额:
-- - 项目类别:
Standard Grant
EAGER: Mechanical Behavior of Metal/Ceramic Nanolaminate Composites; Experiments and Simulation
EAGER:金属/陶瓷纳米层压复合材料的机械行为;
- 批准号:
1647568 - 财政年份:2016
- 资助金额:
-- - 项目类别:
Standard Grant
Materials World Network: High Temperature Mechanical Behavior of Metal/Ceramic Nanolaminate Composites
材料世界网:金属/陶瓷纳米层压复合材料的高温机械行为
- 批准号:
1209928 - 财政年份:2012
- 资助金额:
-- - 项目类别:
Standard Grant
Mechanical Shock and Vibration Fatigue Behavior of Environmentally-Benign PB-Free Solders in Electronic Packaging
电子封装中环保无铅焊料的机械冲击和振动疲劳行为
- 批准号:
0805144 - 财政年份:2008
- 资助金额:
-- - 项目类别:
Continuing Grant
Mechanical Behavior of Nanolayered Metal/Ceramic Composite Coatings
纳米层金属/陶瓷复合涂层的机械性能
- 批准号:
0504781 - 财政年份:2005
- 资助金额:
-- - 项目类别:
Continuing Grant
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